Terabus: Terabit/Second-Class Card-Level Optical Interconnect Technologies by Schares, L., Kash, J.A., Doany, F.E., Schow, C.L., Schuster, C., Kuchta, D.M., Pepeljugoski, P.K., Trewhella, J.M., Baks, C.W., John, R.A., Shan, L., Kwark, Y.H., Budd, R.A., Chiniwalla, P., Libsch, F.R., Rosner, J., Tsang, C.K., Patel, C.S., Schaub, J.D., Dangel, R., Horst, F., Offrein, B.J., Kucharski, D., Guckenberger, D., Hegde, S., Nyikal, H., Chao-Kun Lin, Tandon, A., Trott, G.R., Nystrom, M., Bour, D.P., Tan, M.R.T., Dolfi, D.W.

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45RFSOI WLCSP Board Level Package Risk Assessment and Solder Joint Reliability Performance Improvement by Zhang, Haojun, Wu, Zhuo-Jie, Malinowski, John, Carino, Millete, Young-Fisher, Kristina, Trewhella, Jean, Justison, Patrick

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Evolution of optical subassemblies in IBM data communication transceivers by Trewhella, J. M., Johnson, G. W., Hogan, W. K., Karst, D. L.

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Development of a Scalable AiP Module for mmWave 5G MIMO Applications Based on a Double Molded FOWLP Approach by Braun, Tanja, Le, Thi Huyen, Rossi, Marco, Ndip, Ivan, Holck, Ole, Becker, Karl-Friedrich, Bottcher, Mathias, Schiffer, Michael, Aschenbrenner, Rolf, Muller, Friedrich, Voitel, Marcus, Schneider-Ramelow, Martin, Wieland, Marcel, Goetze, Christian, Trewhella, Jean, Berger, Daniel

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Evolution of optical subassemblies in IBM data communicaiton transceivers by Trewhella, Jean M, Johnson, Glen W, Hogan, William K, Karst, Dennis L

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Simulation and design methodology for a 50-Gb/s multiplexer/demultiplexer package by Lei Shan, Meghelli, M., Joong-Ho Kim, Trewhella, J.M., Oprysko, M.M.

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Ray tracing of optical aids: Implications for ocular risk by Ritter, Mark B., Trewhella, Jean M.

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Propagation properties in short lengths of rectangular epoxy waveguides by Olsen, C.M., Trewhella, J.M., Fan, B., Oprysko, M.M.

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Performance comparison of small form factor fiber optic connectors by Trewhella, J.M., DeCusatis, C.M., Fox, J.

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Thermal-mechanical analysis of Terabus high-speed optoelectronic package by Shashikant Hegde, Lei Shan, Kuchta, D.M., Kwark, Y.H., Baks, C.W., Doany, F., Kash, J.A., Trewhella, J.M.

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Model-to-hardware correlations in the design of a 50Gb/s package by Shan, L., Meghelli, M., Rylyakov, A., Trewhella, J., Oprysko, M.

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Thermal impedance measurements of junction-down mounted single-side contact laser diodes by COHEN, Guy, LEI SHAN, AOYAGI, T, OMURA, E, KUCHTA, Daniel, FURMAN, Bruce, ROSNER, Joanna, BAKS, Christian, TREWHELLA, Jean, TATSUOKA, Y, SHIRAI, S, TAKAGI, K

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Performance comparison of small form factor fiber optic connectors by Trewhella, J.M., DeCusatis, C., Fox, J.

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A low-cost ceramic BGA package for 50 Gb/s multiplexing circuit by Shan, L., Trewhella, J., Baks, C., John, R., Dyckman, W., O'Connor, D., Pillai, E.

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A novel low-cost small-form-factor transceiver module by Hogan, W.K., Gaio, D.P., Cohen, M.S., Trewhella, J.M.

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Low-cost fabrication of optical subassemblies by Cohen, M.S., Johnson, G.W., Trewhella, J.M., Lacey, D.L., Oprysko, M.M., Karst, D.L., DeFoster, S.M., Hogan, W.K., Peterson, M.D., Weirick, J.A.

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The Jitney Parallel Optical Interconnect by Crow, J.D., Joong-Ho Choi, Cohen, M.S., Johnson, G., Kuchta, D., Lacey, D., Ponnapalli, S., Pepeljugoski, P., Stawiasz, K., Trewhella, J., Xiao, P., Tremblay, S., Ouimet, S., Lacerte, A., Gauvin, M., Booth, D., Nation, W., Smith, T.L., DeBaun, B.A., Henson, G.D., Igl, S.A., Lee, N.A., Piekarczyk, A.J., Kuczma, A.S., Spanoudis, S.L.

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The accuracy and validity of "routine" X-rays in estimating lumbar disc arthroplasty placement by Marshman, Laurence A G, Trewhella, Matthew, Friesem, Tai, Rampersaud, Y Raja, Le Huec, Jean-Charles, Krishna, Manoj

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The assembly of immunoglobulin-like modules in titin: implications for muscle elasticity by Improta, Sabina, Krueger, Joanna K., Gautel, Mathias, Atkinson, R.Andrew, Lefèvre, Jean-François, Moulton, Stewart, Trewhella, Jill, Pastore, Annalisa

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