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Adhesion promotion at high temperature for epoxy resin or polyimide onto metal by a two-component coupling system of polybenzimidazole and 4-aminophenyl disulfide
by
Xue, Gi
,
Wang, Yongxia
,
Chen, Yiyuan
,
Tsai, Shingsan
,
Jiang, Lusha
Published in
Journal of applied polymer science
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Journal Of Applied Polymer Science
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Organic Polymers
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Physicochemistry Of Polymers
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