Search Results - Tsao, Lung-Chuan

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  1. 1
    Effects of Adding Active Elements to Aluminum-Based Filler Alloys on the Bonding of 6061 Aluminum Alloy and Alumina

    Effects of Adding Active Elements to Aluminum-Based Filler Alloys on the Bonding of 6061 Aluminum Alloy and Alumina by Sun, Yu-Kai, Chang, Shih-Ying, Tsao, Lung-Chuan, Chuang, Tung-Han, Zhang, Guo-Zhan, Yeh, Chih-Yi

    Published in Applied sciences
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  2. 2
    Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper

    Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper by Tsao, Lung-Chuan, Li, Cheng-Kai, Sun, Yu-Kai, Chang, Shih-Ying, Chuang, Tung-Han

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  3. 3
    Effect of Heat Treatment Conditions on the Mechanical Properties and Machinability of Ti15SnxCu Alloys

    Effect of Heat Treatment Conditions on the Mechanical Properties and Machinability of Ti15SnxCu Alloys by Tsao, Lung-Chuan

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  4. 4
    Influence of Al2O3 Nanoparticles on the Morphology and Growth Kinetics of Cu-Sn Intermetallic Compounds in Sn-Ag-Zn/Cu Solder Joints

    Influence of Al2O3 Nanoparticles on the Morphology and Growth Kinetics of Cu-Sn Intermetallic Compounds in Sn-Ag-Zn/Cu Solder Joints by Tsao, Lung-Chuan, Lai, Pei-Chun

    Published in Crystals (Basel)
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  5. 5
    The influences of chromium addition and quenching treatment on the mechanical properties and fracture behaviors of diffusion-alloyed powder metal steels

    The influences of chromium addition and quenching treatment on the mechanical properties and fracture behaviors of diffusion-alloyed powder metal steels by Wu, Ming-Wei, Tsao, Lung-Chuan, Chang, Shih-Ying

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  6. 6
    Influences of argon plasma cleaning on the die-shear force of chip and copper/polyimide flexible substrate assembly using a non-conductive film

    Influences of argon plasma cleaning on the die-shear force of chip and copper/polyimide flexible substrate assembly using a non-conductive film by Tsao, Lung-Chuan, Lin, Yen-Hui, Chuang, Cheng-Li, Chen, Jun-You

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  7. 7
    Influence of Al[sub.2]O[sub.3] Nanoparticles on the Morphology and Growth Kinetics of Cu-Sn Intermetallic Compounds in Sn-Ag-Zn/Cu Solder Joints

    Influence of Al[sub.2]O[sub.3] Nanoparticles on the Morphology and Growth Kinetics of Cu-Sn Intermetallic Compounds in Sn-Ag-Zn/Cu Solder Joints by Tsao, Lung-Chuan, Lai, Pei-Chun

    Published in Crystals (Basel)
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  8. 8
    Morphology and kinetics of discontinuous precipitation and dissolution in an Fe-8.5Al-27Mn-1.0Si-0.92C alloy

    Morphology and kinetics of discontinuous precipitation and dissolution in an Fe-8.5Al-27Mn-1.0Si-0.92C alloy by CHANG, Shih-Ying, WANG, Shiuan-Sheng, TSAO, Lung-Chuan, CHUANG, Tung-Han

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  9. 9
    Improved Mechanical and Corrosion Properties of Powder Metallurgy Austenitic, Ferritic, and Martensitic Stainless Steels by Liquid Phase Sintering

    Improved Mechanical and Corrosion Properties of Powder Metallurgy Austenitic, Ferritic, and Martensitic Stainless Steels by Liquid Phase Sintering by Ku, Ming-Hsiang, Tsao, Lung-Chuan, Tsai, Yu-Jin, Lin, Zih-Jie, Wu, Ming-Wei

    Published in Materials
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  10. 10
    Prediction of package warpage combined experimental and simulation for four maps substrate

    Prediction of package warpage combined experimental and simulation for four maps substrate by Wu, R W, Chen, C K, Lung-Chuan Tsao

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  11. 11
    Morphology and kinetics of discontinuous preciptiation and dissolution in an Fe-8.5A1-27Mn-1.0Si-0.92C alloy

    Morphology and kinetics of discontinuous preciptiation and dissolution in an Fe-8.5A1-27Mn-1.0Si-0.92C alloy by Shih-Ying, Chang, Wang, Shiuan-Sheng, Tsao, Lung-Chuan, Tung-Han, Chuang

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