Effect of hourglass shape solder joints on underfill encapsulation process: numerical and experimental studies by Nashrudin, Muhammad Naqib, Gan, Zhong Li, Abas, Aizat, Ishak, M.H.H, Tura Ali, M. Yusuf

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A novel analytical filling time chart for design optimization of flip-chip underfill encapsulation process by Ng, Fei Chong, Ali, M. Yusuf Tura, Abas, Aizat, Khor, C. Y., Samsudin, Z., Abdullah, M. Z.

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Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings by Ng, Fei Chong, Abas, Aizat, Gan, Z.L., Abdullah, M.Z., Che Ani, F., Yusuf Tura Ali, M.

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Analytical and numerical analyses of filling progression and void formation in flip-chip underfill encapsulation process by Ng, Fei Chong, Abas, Aizat, Nashrudin, Muhammad Naqib, Tura Ali, M. Yusuf

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Investigation of corrosion on SAC 305, SAC 0307 and SAC 0307-0.03 P-0.005 Ni solder paste alloys in simulated body fluid (SBF) by Sarveswaran, C., Salleh, Emee Marina, Jalar, A., Samsudin, Z., Ali, M. Yusuf Tura, Ani, F. Che, Othman, N. K.

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Investigation of electrochemical migration on Sn-0.7Cu-0.3Ag-0.03P-0.005Ni solder alloy in HNO{sub 3} solution by Sarveswaran, C., Othman, N. K., Ali, M. Yusuf Tura, Ani, F. Che, Samsudin, Z.

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Investigation of electrochemical migration on Sn-0.7Cu-0.3Ag-0.03P-0.005Ni solder alloy in HNO3 solution

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No-flow underfill: Effect of chip placement speed on the void formation using numerical method by Nashrudin, Muhammad Naqib, Abas, Aizat, Abdullah, M.Z., Ali, M. Yusuf Tura, Samsudin, Z., Mansor, Idris

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Effect of different temperature distribution on multi-stack BGA package by Tung, Lun Hao, Ng, Fei Chong, Abas, Aizat, Abdullah, M.Z, Samsudin, Zambri, Tura Ali, Mohd Yusuf

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