The costs of surgical site infection after abdominal surgery in middle-income countries: Key resource use In Wound Infection (KIWI) study by Jowett, S., Bhangu, A., Morton, D.G., Ghosh, D., Adagrah, L.A., Alhaji Alhassan, B.B., Amoako-Boateng, M.P., Appiah, A.B., Koggoh, P., Opandoh, I.N.M., Manu Maison Patrick Opoku Manu, M.A., Morna, M.T., Quartson, E.M., Koomson, B., Fosu, G., Serbeh, G., Acheampong, D.O., Acquaye, J., Adinku, M., Appiah, J., Arthur, J., Boakye-Yiadom, J., Boateng, E.A., Dally, C., Gyasi-Sarpong, C.K., Kwarley, N., Lovi, A.K., Nimako, B., Nyadu, B.B., Opoku, D., Osabutey, A., Tuffour, S., Yorke, J., Addo, K.G., Akosa, E.A., Kontor, B.E., Kyeremeh, C., Mensah, E., Toffah, G.K., Adu-Brobbey, R., Labaran, A.H., Owusu, A., Bennin, A., Kantanka, R.S., Kobby, E., Owusu, P.Y., Sie-Broni, C.A., Zume, M., Abdulai, D.R., Ayingayure, E., Osman, I., Kunfah, S., Musah, Y., Ofori, B., Owusu, E.A., Saba, A.H., Seidu, A.S., Tabiri, S., Ta-ang Yenli, E.M., Dhiman, J., Dhir, K., Hans, M., Haque, P., Mark Jesudason, E.D., K, P., Madankumar, L., Nagomy, I., Prasad, S., Kurien, E., Mathew, A., Prakash, D., Susan, A., Ortiz, R.C., Gonzalez, G.H., Miguelena, L.H., Romero, M.H., Aguirre, C.C., Mejia, H.O., Gomez del Campo, L.U., Sánchez, I.D., Vazquez, D.G., Lara, M.M., Sainz de la Fuente, A.N., Adeleye, V., Atoyebi, O., Belie, O., Ekwesianya, A., Ezenwankwo, F., Fatuga, A., Mokwenyei, O., Ogein, O., Oladimeji, A., Seyi-Olajide, J., Soibi-Harry, A., Ugwu, A., Williams, E., Agodirin, S., Lawal, S., Lawal, A., Shittu, A.

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A comparison of electrostatic discharge models and failure signatures for CMOS integrated circuit devices by Kelly, M., Servais, G., Diep, T., Lin, D., Twerefour, S., Shah, G.

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Failure Analysis of No-Clean and Water-Clean Solder Joints 0.4 mm Pitch, 256-Pin Plastic Quad Flat Pack by Govila, R. K, Pao, Y.-H, Larner, C, Lau, J, Twerefour, S, Erasmus, S, Dolot, S

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Reliability of 0.4 mm Pitch, 256-pin Plastic Quad Flat Pack No-clean and Water-clean Solder Joints by Lau, J, Pao, Y.-H, Larner, C, Govila, R, Twerefour, S, Gilbert, D, Erasmus, S, Dolot, S

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A comparison of electrostatic discharge models and failure signatures for CMOS integrated circuit devices by Kelly, M., Servais, G., Diep, T., Lin, D., Twerefour, S., Shah, G.

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Comparison of electrostatic discharge models and failure signatures for CMOS integrated circuit devices by Kelly, M, Diep, T, Twerefour, S, Servais, G, Lin, D, Shah, G

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Reliability of 0.4 mm pitch, 256-pin plastic quad flat pack no-clean and water-clean solder joints by Lau, J., Yi-Hsin Pao, Larner, C., Govila, R., Twerefour, S., Gilbert, D., Erasmus, S., Dolot, S.

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Reliability of 0.4 mm Pitch, 256pin Plastic Quad Flat Pack Noclean and Waterclean Solder Joints by Lau, J., Pao, Y.H., Larner, C., Govila, R., Twerefour, S., Gilbert, D., Erasmus, S., Dolot, S.

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Social justice content in counseling journals: Comparison of publication rates by Dollarhide, Colette T., Middleton, Tanya, Burciaga, Liliana, Casani, Jennifer, Dockery, Natese, Fraley, Audia M., Karkhanis, Sailee, Levine, Allison, Lynn, Michele, Mushunje, Rumbidzai, Osei Twerefour, Ildico Harriet, Shrewsbury‐Braxton, Sarah

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Development of an algorithm for automatic detection of oil slicks from synthetic aperture radar (SAR) imagery in the Gulf OF Guinea by Sefah-Twerefour, A. A., Wiafe, G., Agyekum, Kwame Adu

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