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Magnetic properties and microstructure of FePtC films with TiOC/MoC combined intermediate layer
by
Tsai, Jai-Lin
,
Hu, Keng-Chun
,
Tzeng, Jie-Lin
Published in
Surface & coatings technology
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Microstructure and magnetic properties of FePt film with combined MoC/(Mg–X)O (X=Cu, Ni, Co) intermediate layers
by
Tsai, Jai-Lin
,
Tzeng, Jie-Lin
,
Hu, Keng-Chun
,
Li, Hsu-Kang
,
Pan, Zu-Yu
,
Chang, Yuan-Shuo
,
Liao, Chang-Chun
Published in
Journal of magnetism and magnetic materials
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Enhancement of band-edge emission induced by defect transition in the composite of ZnO nanorods and CdSe/ZnS quantum dots
by
TZENG, Lin-Jie
,
CHENG, Chung-Liang
,
CHEN, Yang-Fang
Published in
Optics letters
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An Energy Recycling Envelope Tracking Supply Modulator Assisted by Small Cap Replica With 89.7% Efficiency and 37% Reduced Linear Amplifier Current for 150 MHz Bandwidth 5G New Rad...
by
Huang, Chong-Sin
,
Tzeng, Tzu-Yu
,
Huang, Wei-Cheng
,
Kao, Yi-Hsiang
,
Wu, Jie-Lin
,
Chen, Ke-Horng
,
Lin, Ying-Hsi
,
Lin, Shian-Ru
,
Tsai, Tsung-Yen
Published in
IEEE journal of solid-state circuits
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Microstructural Evolution of Cu/Solder/Cu Pillar-Type Structures with Different Diffusion Barriers
by
Cheng, Hsi-Kuei
,
Lin, Yu-Jie
,
Chen, Chih-Ming
,
Liu, Kuo-Chio
,
Wang, Ying-Lang
,
Liu, Tzeng-Feng
Published in
Metallurgical and materials transactions. A, Physical metallurgy and materials science
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Unusual Morphological Evolution of the Cu Pillar/Solder Micro-joints During High-Temperature Annealing
by
Cheng, Hsi-Kuei
,
Lin, Yu-Jie
,
Chang, Hou-Chien
,
Liu, Kuo-Chio
,
Wang, Ying-Lang
,
Liu, Tzeng-Feng
,
Chen, Chih-Ming
Published in
Metallurgical and materials transactions. A, Physical metallurgy and materials science
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