Search Results - Uřičář, Jonáš

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  1. 1
    Degradation of nanofiber layers made of biobased polyamide 4

    Degradation of nanofiber layers made of biobased polyamide 4 by Reinšteinová, Lucie, Benešová, Václava, Uřičář, Jonáš, Holec, Pavel, Brožek, Jiří

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  2. 2
    Application of solid-phase microextraction arrows for characterizing volatile organic compounds from 3D printing of acrylonitrile-styrene-acrylate filament

    Application of solid-phase microextraction arrows for characterizing volatile organic compounds from 3D printing of acrylonitrile-styrene-acrylate filament by Minář, Jaroslav, Pilnaj, Dominik, Uřičář, Jonáš, Veselý, Petr, Dušek, Karel

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  3. 3
    Wettability in lead-free soldering: Effect of plasma treatment in dependence on flux type

    Wettability in lead-free soldering: Effect of plasma treatment in dependence on flux type by Králová, Iva, Pilnaj, Dominik, Pop-Georgievski, Ognen, Uřičář, Jonáš, Veselý, Petr, Klimtová, Markéta, Dušek, Karel

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  4. 4
    Thermal stability of valuable metals in lithium-ion battery cathode materials: Temperature range 100–400 °C

    Thermal stability of valuable metals in lithium-ion battery cathode materials: Temperature range 100–400 °C by Klusoňová, Nikola, Sedláčková, Eliška, Kočí, Jan, Pilnaj, Dominik, Pánová, Karolína, Uřičář, Jonáš, Procházka, Václav, Jílková, Kristýna, Pražanová, Anna, Míka, Martin Havlík

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  5. 5
    Coupled Thermogravimetric Analysis-Potentiometric Titration for Complex Analysis of Poly(vinyl chloride) Thermal Stability

    Coupled Thermogravimetric Analysis-Potentiometric Titration for Complex Analysis of Poly(vinyl chloride) Thermal Stability by Uřičář, Jonáš, Chodounská, Anežka, Benešová, Václava, Brožek, Jiří, Kalousková, Radka

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  6. 6
    Effect of temperature profile and chemical composition of the flux on void formation in solder joints: in-depth analysis

    Effect of temperature profile and chemical composition of the flux on void formation in solder joints: in-depth analysis by Kozak, Martin, Vesely, Petr, Pilnaj, Dominik, Uricar, Jonas, Dusek, Karel

    Published in Welding in the world
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  7. 7
    An Expired Solder Paste vs Fresh Solder Paste: Reliability and Sustainability in Electronics Manufacturing

    An Expired Solder Paste vs Fresh Solder Paste: Reliability and Sustainability in Electronics Manufacturing by Busek, David, Uricar, Jonas, Pilnaj, Dominik

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  8. 8
    3D printing conductive pastes based on polystyrene/graphite composite

    3D printing conductive pastes based on polystyrene/graphite composite by Uricar, Jonas, Vesely, Petr, Pilnaj, Dominik, Sedlacek, Josef, Brozek, Jiri

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  9. 9
    Sustainability Challenges: The Circular Economy Dilemma in Lithium-Ion Battery Cell Electrochemical Discharging Processes

    Sustainability Challenges: The Circular Economy Dilemma in Lithium-Ion Battery Cell Electrochemical Discharging Processes by Prazanova, Anna, Plachy, Zbynek, Uricar, Jonas, Pilnaj, Dominik, Koci, Jan, Knap, Vaclav

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  10. 10
    Analysis of Composite BiSn Solder Paste Doped by Titanium Dioxide Nanoparticles

    Analysis of Composite BiSn Solder Paste Doped by Titanium Dioxide Nanoparticles by Kralova, Iva, Babets, Vasyl, Uricar, Jonas, Wong, Yew Hoong, Sabri, Mohd Faizul Mohd

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  11. 11
    Influence of Reflow Temperature Profile on the Intermetallic Layers Thickness at Different Surface Finishes

    Influence of Reflow Temperature Profile on the Intermetallic Layers Thickness at Different Surface Finishes by Dusek, Karel, Vesely, Petr, Busek, David, Fros, Denis, Kralova, Iva, Klimtova, Marketa, Pilnaj, Dominik, Uricar, Jonas, Plachy, Zbynek, Sorokina, Kristina, Hintermuller, Jan, Dayoub, Ali, Medgyes, Balint, Krammer, Oliver, Geczy, Attila, Illes, Balazs

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