Effect of contact metallization on electromigration reliability of Pb-free solder joints by Ding, Min, Wang, Guotao, Chao, Brook, Ho, Paul S., Su, Peng, Uehling, Trent

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Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages by Chae, Seung-Hyun, Zhang, Xuefeng, Lu, Kuan-Hsun, Chao, Huang-Lin, Ho, Paul S, Ding, Min, Su, Peng, Uehling, Trent, Ramanathan, Lakshmi N

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Analysis of Thin Flip Chip Chip-Scale Package Warpage Causes and Variations by Foong, CS, Afripin, Amirul, Lakhera, Nishant, Uehling, Trent

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Copper Pillar Voids in a Flip Chip Package During High Temperature Application by Wang, Miao, Mavinkurve, Amar, Roucou, Romuald, Afripin, Amirul, Uehling, Trent, Foong, Cs, Lakhera, Nishant

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Simulation and Reliability Study of Cu/Low-k Devices in Flip-chip Packages by Zhao, J.-H., Wilkerson, Brett, Uehling, Trent

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Electromigration lifetime statistics for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages by Seung-Hyun Chae, Xuefeng Zhang, Huang-Lin Chao, Kuan-Hsun Lu, Ho, P.S., Min Ding, Peng Su, Trent Uehling, Ramanathan, L.N.

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Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages: Lead-free electronic solders by CHAE, Seung-Hyun, XUEFENG ZHANG, LU, Kuan-Hsun, CHAO, Huang-Lin, HO, Paul S, MIN DING, PENG SU, UEHLING, Trent, RAMANATHAN, Lakshmi N

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A study of electromigration failure in Pb-free solder joints by Min Ding, Guotao Wang, Chao, B., Ho, P.S., Peng Su, Uehling, T., Wontor, D.

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Effects of UBM thickness, contact trace structure and solder joint scaling on electromigration reliability of Pb-free solder joints by Seung-Hyun Chae, Im, J., Uehling, T., Ho, P.S.

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An evaluation of electromigration performance of SnPb and Pb-free flip chip solder joints by Peng Su, Min Ding, Uehling, T., Wontor, D., Ho, P.S.

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Integration of a mechanically reliable 65-nm node technology for low-k and ULK interconnects with various substrate and package types by Goldberg, C., Downey, S., Fiori, V., Fox, R., Hess, K., Hinsinger, O., Humbert, A., Jacquemin, J.-P., Lee, S., Lhuillier, J.-B., Orain, S., Pozder, S., Proenca, L., Quercia, F., Sabouret, E., Tu Anh Tran, Uehling, T.

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