Search Results - Ugsornrat, Kessararat

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  1. 1
    Electrochemical Sensing Performances of Screen-Printed Graphene-Carbon-Paste Electrodes on Digital Microfluidic Chips

    Electrochemical Sensing Performances of Screen-Printed Graphene-Carbon-Paste Electrodes on Digital Microfluidic Chips by Ugsornrat, Kessararat, Saenkhamai, Anan, Chantaraklud, Apichaya, Pasakon, Patiya, Karuwan, Chanpen, Sriprachuabwong, Chakrit, Atthi, Nithi, Wisitsoraat, Anurat, Tuantranont, Adisorn

    Published in IEEE sensors journal
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  2. 2
    Low-Cost and Disposable Electrowetting-on-Dielectric Lab on a Chip With an Integrated Electrochemical Detector Fabricated by Screen-Printing Process

    Low-Cost and Disposable Electrowetting-on-Dielectric Lab on a Chip With an Integrated Electrochemical Detector Fabricated by Screen-Printing Process by Ugsornrat, Kessararat, Pasakon, Patiya, Karuwan, Chanpen, Sriprachuabwong, Chakrit, Maturos, Thitima, Pogfay, Tawee, Wisitsoraat, Anurat, Tuantranont, Adisorn

    Published in IEEE sensors journal
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  3. 3
    Electrowetting-on-dielectric chip with integrated screen-printed electrochemical sensor for rapid chemical analysis

    Electrowetting-on-dielectric chip with integrated screen-printed electrochemical sensor for rapid chemical analysis by Ugsornrat, Kessararat, Maturos, Thitima, Pasakon, Patiya, Karuwan, Chanpen, Pogfay, Tawee, Sriprachuabwong, Chakrit, Wisitsoraat, Anurat, Tuantranont, Adisorn

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  4. 4
    Warpage of QFN Package in Post Mold Cure Process of integrated circuit packaging

    Warpage of QFN Package in Post Mold Cure Process of integrated circuit packaging by Sriwithoon, Nattha, Ugsornrat, Kessararat, Srisuwitthanon, Warayoot, Thonglor, Panakamon

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  5. 5
    Effecting aging time of epoxy molding compound to molding process for integrated circuit packaging

    Effecting aging time of epoxy molding compound to molding process for integrated circuit packaging by Tachapitunsuk, Jirayu, Ugsornrat, Kessararat, Srisuwitthanon, Warayoot, Thonglor, Panakamon

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  6. 6
    The Effect of Epoxy Molding Compound Floor Life to Reliability Performance and mold ability for QFN Package

    The Effect of Epoxy Molding Compound Floor Life to Reliability Performance and mold ability for QFN Package by Peanpunga, Udom, Ugsornrat, Kessararat, Thorlor, Panakamol, Sumithpibul, Chalermsak

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  7. 7
    Design, Simulation, and Experimental Study of a Droplet-Based PCR by EWOD

    Design, Simulation, and Experimental Study of a Droplet-Based PCR by EWOD by Ugsornrat, K, Afzulpurkar, N V, Wisitsoraat, A, Tuantranont, A

    Published in Sensors and materials
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  8. 8
    Experimental study of digital microfluidic biochip

    Experimental study of digital microfluidic biochip by Ugsornrat, K., Pogfai, T., Maturos, T., Wisitsoraat, A., Tuantranont, A.

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  9. 9
    Single plate electrowetting on dielectric biochip

    Single plate electrowetting on dielectric biochip by Chandee, C., Ugsornrat, K., Uyawapee, P., Pogfai, T., Maturos, T., Pokarattakul, D., Tuantranont, A.

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  10. 10
    Design and experimental study of electrochemical detector with EWOD for chemical analysis

    Design and experimental study of electrochemical detector with EWOD for chemical analysis by Ugsornrat, K., Pogfai, T., Maturos, T., Kuruwan, C., Wisitsoraat, A., Tuantranont, A.

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