Search Results - Utz-Kistner, A.~

  • Showing 1 - 7 results of 7
Refine Results
  1. 1
    Dbc (direct bond copper) substrate with integrated flat heat pipe

    Dbc (direct bond copper) substrate with integrated flat heat pipe by Schulz-Harder, J., Dezord, J.B., Schaeffer, C., Avenas, Y., Puig, O., Rogg, A., Exel, K., Utz-Kistner, A.

    Request full text
    Items that cite this one
    Conference Proceeding
    Save to List
    Saved in:
  2. 2
    Constructing a heterogeneous interlayer in relieving the residual stresses for the AlN/Cu brazed joint used in IGBT

    Constructing a heterogeneous interlayer in relieving the residual stresses for the AlN/Cu brazed joint used in IGBT by Lu, Chuanyang, Zhang, Chengyin, Xu, Haitao, Zhou, Jiahe, Gu, Xiaolong, Liu, Ping, Shi, Lei, Jin, Xia, Li, Yan, Wang, Yuhang, Li, Huaxin, Yang, Jianguo, He, Yanming

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  3. 3
    Thermal effects in packaging high power light emitting diode arrays

    Thermal effects in packaging high power light emitting diode arrays by Christensen, Adam, Graham, Samuel

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  4. 4
    Thermal Stability of Silver Paste Sintering on Coated Copper and Aluminum Substrates

    Thermal Stability of Silver Paste Sintering on Coated Copper and Aluminum Substrates by Pei, Chun, Chen, Chuantong, Suganuma, Katsuaki, Fu, Guicui

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  5. 5
    Modeling and simulation of power electronic modules with microchannel coolers for thermo-mechanical performance

    Modeling and simulation of power electronic modules with microchannel coolers for thermo-mechanical performance by Xu, Ling, Liu, Yong, Liu, Sheng

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  6. 6
    DBC Technology for Low Cost Power Electronic Substrate Manufacturing

    DBC Technology for Low Cost Power Electronic Substrate Manufacturing by Hromadka, Karel, Stulik, Jiri, Reboun, Jan, Hamacek, Ales

    Published in Procedia engineering
    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  7. 7
    A new method for preparation of direct bonding copper substrate on Al 2O 3

    A new method for preparation of direct bonding copper substrate on Al 2O 3 by He, Hong, Fu, Renli, Wang, Deliu, Song, Xiufeng, Jing, Min

    Published in Materials letters
    Get full text
    Article
    Save to List
    Saved in:

Search Tools: