Search Results - Vass-Varnai, Andras

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  1. 1
    Package hermeticity testing with thermal transient measurements

    Package hermeticity testing with thermal transient measurements by Vass-Várnai, András, Rencz, Márta

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  2. 2
    Usage of porous Al2O3 layers for RH sensing

    Usage of porous Al2O3 layers for RH sensing by Timár-Horváth, Veronika, Juhász, László, Vass-Várnai, András, Perlaky, Gergely

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  3. 3
    Characterization of solar cells by thermal transient testing

    Characterization of solar cells by thermal transient testing by Plesz, Balázs, Vass-Várnai, András

    Published in Microelectronics
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  4. 4
    Characterization method for thermal interface materials imitating an in-situ environment

    Characterization method for thermal interface materials imitating an in-situ environment by Vass-Várnai, András, Sárkány, Zoltán, Rencz, Márta

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  5. 5
    A detailed IC package numerical model calibration methodology

    A detailed IC package numerical model calibration methodology by Bornoff, R., Vass-Varnai, A.

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  6. 6
    Automated structure function object mapping

    Automated structure function object mapping by Blackmore, Byron, Bornoff, Robin, Proulx, Joe, Vass-Varnai, Andras

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  7. 7
    Effect of power cycling parameters on predicted IGBT lifetime

    Effect of power cycling parameters on predicted IGBT lifetime by Sarkany, Zoltan, Vass-Varnai, Andras, Rencz, Marta

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  8. 8
    Thermal transient analysis of semiconductor device degradation in power cycling reliability tests with variable control strategies

    Thermal transient analysis of semiconductor device degradation in power cycling reliability tests with variable control strategies by Sarkany, Zoltan, Vass-Varnai, Andras, Laky, Sandor, Rencz, Marta

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  9. 9
    Transient thermal characterization of a fcBGA-H device

    Transient thermal characterization of a fcBGA-H device by Ouyang, E., Ahn, B., Bornoff, R., Weikun He, Islam, N., Gwang Kim, KyungOe Kim, Vass-Varnai, A.

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  10. 10
    New level of accuracy in TIM measurements

    New level of accuracy in TIM measurements by Vass-Varnai, A, Szekely, V, Sarkany, Z, Rencz, M

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  11. 11
    Tackling reliability of power module

    Tackling reliability of power module by He, Weikun Jimmy, Vass-Varnai, Andras, Wilson, John

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  12. 12
    Reliability testing of TIM materials with thermal transient measurements

    Reliability testing of TIM materials with thermal transient measurements by Vass-Varnai, A., Sarkany, Z., Rencz, M.

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  13. 13
    Lifetime estimation of power electronics modules considering the target application

    Lifetime estimation of power electronics modules considering the target application by Szel, Attila, Sarkany, Zoltan, Bein, Marton, Bornoff, Robin, Vass-Varnai, Andras, Rencz, Marta

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  14. 14
    Full-circuit 3D electro-thermal modeling of an IGBT Power Inverter

    Full-circuit 3D electro-thermal modeling of an IGBT Power Inverter by Bornoff, Robin, Vass-Varnai, Andras, Blackmore, Byron, Gang Wang, Voon Hon Wong

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  15. 15
    Measuring the RthJC of Power Semiconductor Components Using Short Pulses

    Measuring the RthJC of Power Semiconductor Components Using Short Pulses by Singh, Sujay, Proulx, Joseph, Vass-Varnai, Andras

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  16. 16
    Possibilities of humidity sensing with thermal transient testing on porous structures

    Possibilities of humidity sensing with thermal transient testing on porous structures by Vass-Varnai, A., Furjes, P., Rencz, M.

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  17. 17
    Suggestions for Extending the Scope of the Transient Dual Interface Method

    Suggestions for Extending the Scope of the Transient Dual Interface Method by Poppe, Andras, Vass-Varnai, Andras, Sarkany, Zoltan, Rencz, Marta, Hantos, Gusztav, Farkas, Gabor

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  18. 18
    Issues of finding a proper golden-reference sample for TIM tester calibration

    Issues of finding a proper golden-reference sample for TIM tester calibration by Vass-Varnai, Andras, Laky, S., Sarkany, Z., Barna, C., Rencz, M.

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  19. 19
    Issues in junction-to-case thermal characterization of power packages with large surface area

    Issues in junction-to-case thermal characterization of power packages with large surface area by Vass-Varnai, Andras, Shan Gao, Sarkany, Zoltan, Jongman Kim, Seogmoon Choi, Farkas, Gabor, Poppe, Andras, Rencz, Marta

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  20. 20
    Rapid Assessment of Semiconductor Thermal Quality

    Rapid Assessment of Semiconductor Thermal Quality by Wong, Voon Hon, Vass-Varnai, Andras, Caruso, Antonio, Cho, Young Joon, Lee, Yong Seoung, Lee, Kwon Hyung

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