Critical study of thermosonic copper ball bonding by Srikanth, N., Murali, S., Wong, Y.M., Vath, Charles J.

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Effect of wire size on the formation of intermetallics and Kirkendall voids on thermal aging of thermosonic wire bonds by Murali, S., Srikanth, N., Vath, Charles J.

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Grains, deformation substructures, and slip bands observed in thermosonic copper ball bonding by Murali, S, Srikanth, N, Vath, Charles J

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Adhesion improvement of EMC–leadframe interface using brown oxide promoters by Srikanth, Narasimalu, Chan, Lewis, Vath, Charles J.

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Development of compliant coating system for transfer molding of sensitive silicon dice by Srikanth, N., Kuah, T.H., Ho, S.C., Vath, Charles J.

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An analysis of intermetallics formation of gold and copper ball bonding on thermal aging by Murali, S, Srikanth, N, Vath, Charles J

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Development of Large Die Fine-Pitch Cu/Low- k FCBGA Package With Through Silicon via (TSV) Interposer by Tai Chong Chai, Xiaowu Zhang, Lau, J H, Selvanayagam, C S, Damaruganath, P, Hoe, Y Y G, Yue Ying Ong, Rao, V S, Wai, E, Hong Yu Li, Liao, E B, Ranganathan, N, Vaidyanathan, K, Shiguo Liu, Jiangyan Sun, Ravi, M, Vath, C J, Tsutsumi, Y

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Effect of wire diameter on the thermosonic bond reliability by Murali, Sarangapani, Srikanth, Narasimalu, Vath, Charles J.

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Development of compliant coating system for transfer molding of sensitive silicon dies by Srikanth, N, Kuah, T H, Ho, S C, Vath, C J

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Direct gold and copper wires bonding on copper by Ho, Hong Meng, Lam, Wai, Stoukatch, Serguei, Ratchev, Petar, Vath, Charles J., Beyne, Eric

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Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package by Zhang, X., Chai, T.C., Lau, J.H., Selvanayagam, C.S., Biswas, K., Shiguo Liu, Pinjala, D., Tang, G.Y., Ong, Y.Y., Vempati, S.R., Wai, E., Li, H.Y., Liao, E.B., Ranganathan, N., Kripesh, V., Jiangyan Sun, Doricko, J., Vath, C.J.

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Bonding wire options and their impact on product reliability by Vath, C. J., Holliday, R.

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Direct Au and Cu wire bonding on Cu/low-k BEOL by Banda, P., Hong Meng Ho, Whelan, C., Wai Lam, Vath, C.J., Beyne, E.

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Fine pitch copper wire bonding on copper bond pad process optimization by Kan Wai Lam, Hong Meng Ho, Stoukatch, S., Van De Peer, M., Ratchev, P., Vath, C.J., Schervan, A., Beyne, E.

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Bonding on Cu: a new stress evaluation approach by Raman spectroscopy by Jian Chen, Hong Meng Ho, Wai Lam, Ratchev, P., Stoukatch, S., Beyne, E., Vath, C.J., De Wolf, I.

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Effect of Wire Purity on Copper Wire Bonding by Srikanth, N., Premkumar, J., Sivakumar, M., Wong, Y.M., Vath, C.J.

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Design optimization of a limited angle voice coil actuator for use in a wire bonding application by Widdowson, G.P., Kuah, T.H., Vath, C.J.

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Design, analysis and testing of a linear/theta motor for semiconductor applications by Widdowson, G.P., Kuah, T.H., YouYong, L., Vath, C.J.

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Metabolic interplay between Proteus mirabilis and Enterococcus faecalis facilitates polymicrobial biofilm formation and invasive disease by Hunt, Benjamin C, Brix, Vitus, Vath, Joseph, Guterman, Lauren Beryl, Taddei, Steven M, Deka, Namrata, Learman, Brian S, Brauer, Aimee L, Shen, Shichen, Qu, Jun, Armbruster, Chelsie E

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Simulation tool enhances integrated-circuit encapsulation by Kuah, T.H, Yeung, P.H, Vath, III, Charles J, Hung, K.Y

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