Mechanisms of copper direct bonding observed by in-situ and quantitative transmission electron microscopy by Martinez, M., Legros, M., Signamarcheix, T., Bally, L., Verrun, S., Di Cioccio, L., Deguet, C.

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Characterization of a SAW-Pirani vacuum sensor for two different operating modes by Mercier, D., Bordel, G., Brunet-Manquat, P., Verrun, S., Elmazria, O., Sarry, F., Belgacem, B., Bounoua, J.

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True 3D packaging solution for stacked vertical power devices by Rouger, N., Benaissa, L., Widiez, J., Imbert, B., Gaude, V., Verrun, S., Crebier, J. C.

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Reliability tests on micro-insert die bonding technology by Nowodzinski, A., Boutry, H., Franiatte, R., Mandrillon, V., Anciant, R., Verrun, S., Simon, G.

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3D Integration of CMOS image sensor with coprocessor using TSV last and micro-bumps technologies by Coudrain, P., Henry, D., Berthelot, A., Charbonnier, J., Verrun, S., Franiatte, R., Bouzaida, N., Cibrario, G., Calmon, F., O'Connor, I., Lacrevaz, T., Fourneaud, L., Flechet, B., Chevrier, N., Farcy, A., Le-Briz, O.

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Saw-Pirani vacuum sensor with a new functioning mode and a fast response time by Mercier, D., Bordel, G., Brunet-Manquat, P., Verrun, S., Elmazria, O., Sarry, F., Belgacem, B., Bounouar, J.

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First integration of Cu TSV using die-to-wafer direct bonding and planarization by Leduc, P., Assous, M., Di Cioccio, L., Zussy, M., Signamarcheix, T., Roman, A., Rousseau, M., Verrun, S., Bally, L., Bouchu, D., Cadix, L., Farcy, A., Sillon, N.

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3D integration technology for set-top box application by Henry, D., Cheramy, S., Charbonnier, J., Chausse, P., Neyret, M., Brunet-Manquat, C., Verrun, S., Sillon, N., Bonnot, L., Gagnard, X., Saugier, E.

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3D integration process flow for set-top box application: Description of technology and electrical results by Cheramy, S., Charbonnier, J., Henry, D., Astier, A., Chausse, P., Neyret, M., Brunet-Manquat, C., Verrun, S., Sillon, N., Bonnot, L., Gagnard, X., Vittu, J.

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An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling by Di Cioccio, L., Gueguen, P., Taibi, R., Signamarcheix, T., Bally, L., Vandroux, L., Zussy, M., Verrun, S., Dechamp, J., Leduc, P., Assous, M., Bouchu, D., de Crecy, F., Chapelon, L.-L., Clavelier, L.

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Development and characterisation of high electrical performances TSV for 3D applications by Henry, D., Cheramy, S., Charbonnier, J., Chausse, P., Neyret, M., Garnier, G., Brunet-Manquat, C., Verrun, S., Sillon, N., Bonnot, L., Farcy, A., Cadix, L., Rousseau, M., Saugier, E.

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High-performance silver-dielectric interference filters for RGBIR imaging by Frey, Laurent, Masarotto, Lilian, El Melhaoui, Loubna, Verrun, Sophie, Minoret, Stéphane, Rodriguez, Guillaume, André, Agathe, Ritton, Frédéric, Parrein, Pascale

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High pass filter with above IC integrated SrTiO3 high K MIM capacitors by DELAY, Emmanuel, WOLOZAN, David, ULMER, Laurent, AÏD, Marc, ANCEY, Pascal, BLANC, Jean-Pierre, SERRET, Emmanuelle, GARREC, Pierre, VERRUN, Sophie, PELLISSIER, Denis, DELPECH, Philippe, GUILLAN, Julie, ANDRE, Bernard

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High pass filter with above IC integrated SrTiO 3 high K MIM capacitors by Defaÿ, Emmanuel, Wolozan, David, Blanc, Jean-Pierre, Serret, Emmanuelle, Garrec, Pierre, Verrun, Sophie, Pellissier, Denis, Delpech, Philippe, Guillan, Julie, André, Bernard, Ulmer, Laurent, Aïd, Marc, Ancey, Pascal

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Ultra Wide Micro Bumps Interconnection Matrix for High Energy Particle Detection: Process and Assembly by Charbonnier, Jean, Assous, Myriam, Mourier, Thierry, Ribiere, Celine, Minoret, Stephane, Verrun, Sophie, Tissier, Pierre, Coquand, Remi, Bicer, Mehmet, Allain, Fabienne, Franiatte, Remi, Pares, Gabriel

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