Physical and Technological Characteristic Features of the Process of Installation of Dies onto a Temporary Foundation in Internal Wiring Technology by Vertyanov, D. V., Korobova, N. E., Pogudkin, A. V., Kravtsova, V. D.

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Copper-Containing Compositions Based on Alicyclic Polyimide for Microelectronic Applications by Kravtsova, V. D., Umerzakova, M. B., Korobova, N. E., Vertyanov, D. V.

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Modeling of Heat Transfer for a Three-Dimensional Microelectromechanical Mirror Element with Consideration of Its Packaging Features by Evstafyev, S. S., Samoylikov, V. K., Vertyanov, D. V.

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High-performance inline RF MEMS switch for application in 5G mobile networks by Tkachenko, A V, Lysenko, I E, Kovalev, A V, Vertyanov, D V

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Research and Analysis of Thermomechanical Stresses in the Structure of a Wafer with Embedded ICs with Consideration of Temperature Effects in Manufacturing Process Route by Evstafyev, S. S., Solovyov, I. A., Kochergin, M. D., Vertyanov, D. V.

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Study of the Influence of Mechanical and Temperature Effects on the Level of Stresses and Deformations in 3D Microassemblies Hermetically Sealed with Two Types of Compounds by Vertyanov, D. V., Belyakov, I. A., Pogudkin, A. V., Timoshenkov, S. P., Sidorenko, V. N.

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Peculiarities of multichip micro module frameless design with ball contacts on the flexible board by Vertyanov, D. V., Tikhonov, K. S., Timoshenkov, S. P., Petrov, V. S., Blinov, G. A.

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