Search Results - Via, Glen David

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  1. 1
    Low-Temperature Bonded GaN-on-Diamond HEMTs With 11 W/mm Output Power at 10 GHz

    Low-Temperature Bonded GaN-on-Diamond HEMTs With 11 W/mm Output Power at 10 GHz by Pane-Chane Chao, Chu, Kenneth, Creamer, Carlton, Diaz, Jose, Yurovchak, Tom, Shur, Michael, Kallaher, Ray, McGray, Craig, Via, Glen David, Blevins, John D.

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  2. 2
    Guest Editorial Special Section on the 2016 International Conference on Compound Semiconductor Manufacturing Technology (CS MANTECH)

    Guest Editorial Special Section on the 2016 International Conference on Compound Semiconductor Manufacturing Technology (CS MANTECH) by Via, Glen David, Della-Morrow, Celicia, Fay, Patrick

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  3. 3
    A Decomposition Workflow for Integrated Circuit Verification and Validation

    A Decomposition Workflow for Integrated Circuit Verification and Validation by Kimura, Adam, Scholl, Jon, Schaffranek, James, Sutter, Matthew, Elliott, Andrew, Strizich, Mike, Via, Glen David

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  4. 4
    AlInN HEMT grown on SiC by metalorganic vapor phase epitaxy for millimeter-wave applications

    AlInN HEMT grown on SiC by metalorganic vapor phase epitaxy for millimeter-wave applications by Guo, Shiping, Gao, Xiang, Gorka, Daniel, Chung, Jinwoork W., Wang, Han, Palacios, Tomas, Crespo, Antonio, Gillespie, James K., Chabak, Kelson, Trejo, Manuel, Miller, Virginia, Bellot, Mark, Via, Glen, Kossler, Mauricio, Smith, Howard, Tomich, David

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