Search Results - Wagiman, A.N.R.

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  1. 1
    Solder Joint Fatigue in a Surface Mount Assembly Subjected to Mechanical Loading

    Solder Joint Fatigue in a Surface Mount Assembly Subjected to Mechanical Loading by Tamin, M.N., Yek Ban Liew, Wagiman, A.N.R., Loh, W.K.

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  2. 2
    The properties of epoxy resin coated silica fillers composites

    The properties of epoxy resin coated silica fillers composites by Teh, P.L., Mariatti, M., Akil, H.M., Yeoh, C.K., Seetharamu, K.N., Wagiman, A.N.R., Beh, K.S.

    Published in Materials letters
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  3. 3
    Effect of curing agent on the properties of mineral silica filled epoxy composites

    Effect of curing agent on the properties of mineral silica filled epoxy composites by Teh, P.L., Mariatti, M., Wagiman, A.N.R., Beh, K.S.

    Published in Polymer composites
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  4. 4
    Effect of Ethanol as Diluent on the Properties of Mineral Silica Filled Epoxy Composites

    Effect of Ethanol as Diluent on the Properties of Mineral Silica Filled Epoxy Composites by Teh, P.L., Mariatti, M., Akil, H.M., Seetharamu, K.N., Wagiman, A.N.R., Beh, K.S.

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  5. 5
    Solder joint fatigue in a surface-mount assembly subjected to mechanical loading

    Solder joint fatigue in a surface-mount assembly subjected to mechanical loading by Tamin, M.N., Liew, Y.B., Wagiman, A.N.R., Loh, W.K.

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  6. 6
    Assessment of Solder Joint Fatigue Performance Using Cyclic Flexural Loading

    Assessment of Solder Joint Fatigue Performance Using Cyclic Flexural Loading by Tamin, M.N., Liew, Y.B., Wagiman, A.N.R., Loh, W.K.

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  7. 7
    High Filled Epoxy Composites for Electronic Packaging Application

    High Filled Epoxy Composites for Electronic Packaging Application by Teh, P.L., Mariatti, M., Akil, H.M., Seetharamu, K.N., Wagiman, A.N.R., Beh, K.S.

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  8. 8
    Challenges of small form factor 0402 and 0201 die side capacitor assembly process on high density interconnect flip chip substrate

    Challenges of small form factor 0402 and 0201 die side capacitor assembly process on high density interconnect flip chip substrate by LOKE, C. C, CHEONG, Chin-Thong, GOH, Hun-Song, AMIR NUR RASHID WAGIMAN

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