Search Results - Wakil, J.A.

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  1. 1
    Simulating package behavior under power dissipation using uniform thermal loading

    Simulating package behavior under power dissipation using uniform thermal loading by Wakil, J.A., Ho, P.S.

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  2. 2
    Thermal modeling of on-chip interconnects and 3D packaging using EM tools

    Thermal modeling of on-chip interconnects and 3D packaging using EM tools by Jiang, L., Kolluri, S., Rubin, B.J., Smith, H., Colgan, E.G., Scheuermann, M.R., Wakil, J.A., Deutsch, A., Gill, J.

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  3. 3
    Hotspot-Limited Microprocessors: Direct Temperature and Power Distribution Measurements

    Hotspot-Limited Microprocessors: Direct Temperature and Power Distribution Measurements by Hamann, H.F., Weger, A., Lacey, J.A., Zhigang Hu, Bose, P., Cohen, E., Wakil, J.

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  4. 4
    A Practical Implementation of Silicon Microchannel Coolers for High Power Chips

    A Practical Implementation of Silicon Microchannel Coolers for High Power Chips by Colgan, E.G., Furman, B., Gaynes, M., Graham, W.S., LaBianca, N.C., Magerlein, J.H., Polastre, R.J., Rothwell, M.B., Bezama, R.J., Choudhary, R., Marston, K.C., Toy, H., Wakil, J., Zitz, J.A., Schmidt, R.R.

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  5. 5
    A slit-and -expanded aluminum-foil matrix solar collector

    A slit-and -expanded aluminum-foil matrix solar collector by Chiou, J.P., El-Wakil, M.M., Duffie, J.A.

    Published in Solar energy
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