Search Results - Wan, Katch

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  1. 1
    Low Temperature Curable Polyimide Film Properties and WLP Reliability Performance with Various Curing Conditions

    Low Temperature Curable Polyimide Film Properties and WLP Reliability Performance with Various Curing Conditions by Chen, Yu Chuan, Wan, Katch, Chang, Chen An, Lee, Rick

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    The Comparative Study to Enhance Board Level Reliability Performance of Wafer Level Package At 0.25 mm Pitch Using Micro-Ball Drop and Electroplated Solder Technology

    The Comparative Study to Enhance Board Level Reliability Performance of Wafer Level Package At 0.25 mm Pitch Using Micro-Ball Drop and Electroplated Solder Technology by Kuei Hsiao Kuo, Yi Sin Ting, Chui Feng Weng, Feng Lung Chien, Wan, Katch, Ho, C. S., Lee, Rick

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