WET Organic Impurities induced Carbon Contamination on Surface/Sub-surface of Silicon : CFM: Contamination Free Manufacturing by Wai, Wan Tatt

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Determination of TOTOX value in palm oleins using a FI-potentiometric analyzer by Wai, Wan Tatt, Saad, Bahruddin, Lim, Boey Peng

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Sequential Flow Injection Determination of Chlorine Species Using a Triiodide-selective Electrode Detector by SAAD, Bahruddin, WAI, Wan Tatt, ALI, Abdussalam Salhin Mohd, SALEH, Muhammad Idiris

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Determination of free fatty acids in palm oil samples using non-aqueous flow injection titrimetric method by Saad, Bahruddin, Ling, Cheng Woon, Jab, Md Sariff, Lim, Boey Peng, Mohamad Ali, Abdussalam Salhin, Wai, Wan Tatt, Saleh, Muhammad Idiris

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Innovative ceramic membrane plate filtration system for sustainable semiconductor industry wastewater treatment: A pilot scale study by Ang, Wen Jin, Teow, Yeit Haan, Chang, Zhen Hong, Mohammad, Abdul Wahab, Wan, Tatt Wai

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Flow injection determination of anisidine value in palm oil samples using a triiodide potentiometric detector by Saad, Bahruddin, Wai, Wan Tatt, Lim, Boey Peng, Saleh, Muhammad Idiris

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Flow injection determination of peroxide value in edible oils using triiodide detector by Saad, Bahruddin, Wai, Wan Tatt, Lim, Boey Peng, Saleh, Muhammad Idiris

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Development of flow injection spectrophotometric methods for the determination of free available chlorine and total available chlorine: comparative study by Saad, Bahruddin, Wai, Wan Tatt, Jab, Md. Sariff, Wan Ngah, Wan Saime, Saleh, Muhammad Idiris, Slater, Jonathan M.

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Optimising Electroless Copper Plating Parameters on Insulative Substrate for Enhanced Efficiency and Quality by Gan, Yuyin, Ong, Jun Du, Lee, Swee Kah, Wan, Tatt Wai, Low, Siew Chun

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Current Gain Reduction in Bipolar Junction Transistors Induced by Carbon Contamination from H3PO4-Based Etchant by Lik, Tan Chan, Ning, Lim Chui, Wai, Wan Tatt, Johan, Norjuliani, Zakaria, Zafirah, Cheong, Kuan Yew

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Characterization of Dilution Effect of Mix Acids on Rough Silicon Etching Irregularities : CFM: Contamination Free Manufacturing by Wai, Wan Tatt, Ying, Tan Yin, Kai, Cheng Weei, Meera, Brhma Dava

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Al-Cu interconnect corrosion prevention in post metal etch and wet polymer clean wafers: CFM: Contamination free manufacturing by Wai, Wan Tatt, Ling, Ng Cheah

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Characterization of wafer level corrosion for Al-Cu interconnects and Ni-Pd pads by Wan Tatt Wai, Yong Foo Khong, Asmahan, Ishak

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Auger method to characterize metal oxides on titanium tungsten barrier layer for copper pad by Wan Tatt Wai, Yong Foo Khong, Nurhanani, Zakaria, Simon, Faiss

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TEM-EDX Characterization of Immersion Pd & Pd-MoOx on Cu & NiP by Wai, Wan Tatt, Krishnan, Arul

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Palladium-copper inter-diffusion during copper activation for electroless Nickel plating process on Copper power metal by Poo Khai Yee, Wan Tatt Wai, Yong Foo Khong

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XPS Characterization of Ag-Sn Backside Metallization by Chew, Yen Min, Wan, Tatt Wai, Lim, Huat Chye, Cheong, Kuan Yew

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TEM-EDX Line Scan to Investigate O2 Diffusion across Physical Vapor Deposited Al-Cu Layer by Wai, Wan Tatt, Jia Sheng, Ong, Jia, Loh Yeong, Lynn Yien, Low

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Combined Application of AFM-XRD-SIMS to Characterize Crystal Properties in Electroless Nickel Metal Induced by Trace Contaminants by Wai, Wan Tatt, Wei Cheat, Lee, Sing, Lim Saw, Nurhanani, Zakaria

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