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    The impact and performance of electromigration on fine pitch Cu pillar with different bump structure for flip chip packaging

    The impact and performance of electromigration on fine pitch Cu pillar with different bump structure for flip chip packaging by Kuei Hsiao Kuo, Mao, Cindy, Wang, Katch, Lee, Jason, Chien, F. L., Lee, Rick

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    Conference Proceeding
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