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Search Results - Wang, Liujue
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The impact of oxygen content on the reliability of Au-20Sn solder hermetic package
by
Wang, Liujue
,
Xue, Songbai
,
Lin, Yaowei
,
Chen, Hongneng
Published in
Vacuum
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Microstructural evolution and shear performance of AuSn20 solder joint under gamma-ray irradiation and thermal cycling
by
Wen, Li
,
Xue, Songbai
,
Wang, Liujue
,
Liu, Han
,
Wu, Jie
Published in
Journal of materials science. Materials in electronics
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Effect of oxygen content on reliability of Au-20Sn solder joints for the chip-level package
by
Wang, Liujue
,
Xue, Songbai
,
Liu, Han
,
Wang, Jianhao
Published in
Journal of materials science. Materials in electronics
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Study on layer formation behavior of Ag joints sintered with pressureless sintering process
by
Wang, Liujue
,
Ding, Taojie
,
Gu, Lin
,
Sun, Xiaodong
Published in
Materials research express
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Effect of oxygen content on wettability, microstructure and solderability of Au–20Sn solders
by
Wang, Liujue
,
Xue, Songbai
,
Liu, Han
Published in
Journal of materials science. Materials in electronics
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Oxidation thermodynamics and oxidation kinetics analysis of Au-20Sn solder
by
Xue, Peng
,
Fang, Xu
,
Zhang, Yongfeng
,
He, Peng
,
Xue, Songbai
,
Wang, Liujue
Published in
Journal of materials research and technology
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Effects of Trace Oxygen Content on Microstructure and Performances of Au-20Sn/Cu Solder Joints
by
Li, Yang
,
Wu, Di
,
Zhang, Yabin
,
Wang, Liujue
,
Xue, Songbai
Published in
Crystals (Basel)
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Effect of Particle Shapes on Thermal Shock Reliability of Sintered Ag Joints under Low-Temperature Pressureless Sintering
by
Wang, Liujue
,
Ji, Yong
,
Li, Shouwei
,
Mei, Peng
Published in
Journal of materials engineering and performance
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Effect of gamma-ray irradiation on microstructure and mechanical property of Sn63Pb37 solder joints
by
Wang, Jianhao
,
Xue, Songbai
,
Lv, Zhaoping
,
Wang, Liujue
,
Liu, Han
,
Wen, Li
Published in
Journal of materials science. Materials in electronics
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多孔Ta-10%Nb支架制备及其体外生物性能评价
by
苗惊雷
,
刘珏
,
王汇丰
,
杨海林
,
阮建明
Published in
中国有色金属学报(英文版)
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亚洲骨质疏松筛查工具在健康体检中的筛查准确性评价及适宜切点研究
by
王鹏
,
吴华
,
车颖
,
范东伟
,
刘珏
,
陶立元
Published in
北京大学学报(医学版)
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Journal Of Materials Science. Materials In Electronics
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Crystals
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中国有色金属学报
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Oxygen Content
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Reliability
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Soldered Joints
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Au-20Sn Solder
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