An efficient approach to quantify the impact of Cu residue on ELK TDDB by Chang, M.N., Wang, R.C.J., Chiu, C.C., Wu, K.

Request full text

Identification and Layout Modification of Copper/Low k Interconnect Dielectric Reliability Assessment by using RVDB Test by Lin, T.M.Z., Hsu, W.M., Lin, S.R., Wang, R.C.J., Chiu, C.C., Wu, K.

Request full text

Interfacial stress characterization for stress-induced voiding in Cu/low-k interconnects by Wang, R.C.J., Chen, L.D., Yen, P.C., Lin, S.R., Chiu, C.C., Wu, K., Chang-Liao, K.S.

Request full text

The effect of CF/sub 4/ plasma on the device parameters and reliability properties of 0.18 /spl mu/m MOSFETs by Wang, R.C.J., Shih, J.R., Chu, L.H., Doong, K.Y.Y., Wang, L.S., Weil, P.C., Su, D.S., Yang, C.T., Chiu, C.C., Su, D., Peng, Y.K., Yue, J.T., Lee, J.Y.M.

Request full text

Investigation of electromigration properties and plasma charging damages for plasma treatment process in Cu interconnects by Wang, R.C.J., Su, D.S., Yang, C.T., Chen, D.H., Doong, Y.Y., Shih, J.R., Lee, S.Y., Chiu, C.C., Peng, Y.K., Yue, J.T.

Request full text

Short-term transport of glyphosate with erosion in Chinese loess soil--a flume experiment by Yang, Xiaomei, Wang, Fei, Bento, Célia P M, Xue, Sha, Gai, Lingtong, van Dam, Ruud, Mol, Hans, Ritsema, Coen J, Geissen, Violette

Get full text

Decay characteristics and erosion-related transport of glyphosate in Chinese loess soil under field conditions by Yang, Xiaomei, Wang, Fei, Bento, Célia P.M., Meng, Lei, van Dam, Ruud, Mol, Hans, Liu, Guobin, Ritsema, Coen J., Geissen, Violette

Get full text