Kinetics of copper drift in low-κ polymer interlevel dielectrics by Loke, A.L.S., Wetzel, J.T., Townsend, P.H., Tanabe, T., Vrtis, R.N., Zussman, M.P., Kumar, D., Ryu, C., Wong, S.S.

Get full text

Silicon Superlattice on SOI for High Mobility and Reduced Leakage by Mears, R.J., Hytha, M., Dukovski, I., Yiptong, A., Xiangyang Huang, Halilov, S., Broka, A., Stephenson, R.J., Vivek Rao, Webb, D.R., Prasad, R., Kreps, S.A., Takeuchi, H., Ikeda, S., Gebara, G., Matthews, K., Wetzel, J.T., Wade Xiong, Bowen, C., Wise, R., Cleavelin, C.R.

Request full text

Electrical leakage at low-K polyimide/TEOS interface by Loke, A.L.S., Wetzel, J.T., Stankus, J.J., Angyal, M.S., Mowry, B.K., Wong, S.S.

Get full text

Kinetics of copper drift in low-/spl kappa/ polymer interlevel dielectrics by Loke, A.L.S., Wetzel, J.T., Townsend, P.H., Tanabe, T., Vrtis, R.N., Zussman, M.P., Kumar, D., Ryu, C., Wong, S.S.

Get full text

Integration of Low-k Dielectrics and Copper into Sub-250 nm Interconnects by Fowler, B.W., Yu, K.C., Wetzel, J.T.

Get full text

Computer simulation of solute segregation to a H=5 tilt boundary in Au, Cu and Ni by WETZEL, J.T, MACHLIN, E.S

Get full text

Effect of excess silicon on behavior of LPCVD WSi x films on silicon by Joshi, R.V., Kim, Y.H., Wetzel, J.T., Lin, T.

Get full text

Low-k dielectrics characterization for damascene integration by Lin, S., Changming Jin, Lui, L., Minghsing Tsai, Daniels, M., Gonzalez, A., Wetzel, J.T., Monnig, K.A., Winebarger, P.A., Jang, S., Yu, D., Liang, M.S.

Request full text

Computer simulation of solute segregation to a Σ = 5 tilt boundary in Au, Cu and Ni by Wetzel, J.T., Machlin, E.S.

Get full text

Effect of excess silicon on behavior of LPCVD WSix films on silicon by Joshi, R.V., Kim, Y.H., Wetzel, J.T., Lin, T.

Get full text

Computer simulation of solute segregation to a Σ = 5 tilt boundary in Au, Cu and Ni by Wetzel, J.T., Machlin, E.S.

Get full text

Evaluation of material property requirements and performance of ultra-low dielectric constant insulators for inlaid copper metallization by Wetzel, J.T., Lin, S.H., Mickler, E., Lee, J., Ahlbum, B., Jin, C., Fox, R.J., Tsai, M.-H., Mlynko, W., Monnig, K.A., Winebarger, P.M.

Request full text

On the preparation of cross-sectional TEM samples using lithographic processing and reactive ion-etching by Wetzel, J.T., Jost, M., Rishton, S.A., Fryer, P.M., Kwietniak, K.T., Klaus, D., Bucchignano, J.J., Hu, C.-K., Brown, T.J.

Get full text

Anisotropic growth during the coarsening of platinum catalyst particles on flat oxide substrates by WETZEL, J.T, ROTH, L.D, TIEN, J.K

Get full text

Copper drift in low-K polymer dielectrics for ULSI metallization by Loke, A.L.S., Wetzel, J.T., Changsup Ryu, Won-Jun Lee, Wong, S.S.

Request full text

On calculated energies of segregation, grain boundary energies and lattice energy functions by Wetzel, J.T., Machlin, E.S.

Get full text

Anisotropic growth during the coarsening of platinum catalyst particles on flat oxide substrates by Wetzel, J.T., Roth, L.D., Tien, J.K.

Get full text

Preharvest control of Escherichia coli O157 in cattle by LeJeune, J.T, Wetzel, A.N

Get full text

Concerning the relationship between evapotranspiration and soil moisture by Wetzel, P.J, Chang, J.T

Get full text

Steady-State mRNA Levels of G Protein Subunits in Developing Rabbit Myocardium by Fattal, O., Vandop, C., Chen, F., Chang, J.T., Zoltan, T.B., Wetzel, G.T., Klitzner, T.S.

Get full text