Search Results - Witarsa, A R

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  1. 1
    Achievement of quality management system ISO 9001:2015 strategy in Vocational High School

    Achievement of quality management system ISO 9001:2015 strategy in Vocational High School by Irsyada, R, Isbiyantoro, S, Wibawa, A P, Teng, M F, Gaffar, A F O, Herdianto, R, Witarsa, A R

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  2. 2
    Effect of the phaleria macrocarpa extract on proprotein convertase subtilisin/kexin type-9 levels in healthy population

    Effect of the phaleria macrocarpa extract on proprotein convertase subtilisin/kexin type-9 levels in healthy population by Desandri, D R, Witarsa, T R, Sukmawan, R

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  3. 3
    The effect of external counterpulsation on angiopoietin-1 and angiopoietin-2 levels in nondiabetic patients with refractory angina

    The effect of external counterpulsation on angiopoietin-1 and angiopoietin-2 levels in nondiabetic patients with refractory angina by Witarsa, T R, Arityanti, D, Ambari, A M

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  4. 4
    Development of 3-D Stack Package Using Silicon Interposer for High-Power Application

    Development of 3-D Stack Package Using Silicon Interposer for High-Power Application by Khan, N., Seung Wook Yoon, Viswanath, A.G.K., Ganesh, V.P., Nagarajan, R., Witarsa, D., Lim, S., Vaidyanathan, K.

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  5. 5
    Fine pitch copper wire bonding on 45nm tech Cu/low-k chip with different bond pad metallurgy

    Fine pitch copper wire bonding on 45nm tech Cu/low-k chip with different bond pad metallurgy by Leong Ching Wai, Jaafar, N. B., Chew, M., Sivakumar, S., Gunasekaran, G., Kanchet, K., Witarsa, D., Tan Juan Boon, Srinivasa, V. R., Chai, T. C., Alastair, A., Woo, J.

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  6. 6
    Mechanical and microstructure characterization of high aspect ratio electroplated through-wafer copper interconnects

    Mechanical and microstructure characterization of high aspect ratio electroplated through-wafer copper interconnects by Preisser, R., Backus, P., Lim, P., Witarsa, D., Pang, H.L., John, Miao, Jianmin, Xu, Luhua, Dixit, P.

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  7. 7
    Through wafer copper via for silicon based SiP application

    Through wafer copper via for silicon based SiP application by Witarsa, D., Soundarapandian, M., Seung Wook Yoon, Kripesh, V., Teoh Kum Weng, Nagarajan, R., Khan, O.K.N.

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