Search Results - Wohlrabe, Heinz

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  1. 1
    Correlations between process, material and quality characteristics and the reliability of solder joints

    Correlations between process, material and quality characteristics and the reliability of solder joints by Wohlrabe, Heinz, Pantazica, Mihaela

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  2. 2
    Solder paste printing in six-sigma-quality

    Solder paste printing in six-sigma-quality by Wohlrabe, H

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  3. 3
    Evaluation of the quality of SMDs according to vacuum vapour phase soldering

    Evaluation of the quality of SMDs according to vacuum vapour phase soldering by Lungen, Sebastian, Klemm, Alexander, Wohlrabe, Heinz

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  4. 4
    Coplanarity measurements of electronic-components during soldering

    Coplanarity measurements of electronic-components during soldering by Wohlrabe, H.

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  5. 5
    Warpage measurements of SMD-components under soldering conditions

    Warpage measurements of SMD-components under soldering conditions by Wohlrabe, H.

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  6. 6
    New quality cost models to optimize inspection strategies

    New quality cost models to optimize inspection strategies by Oppermann, M., Sauer, W., Wohlrabe, H., Zerna, T.

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  7. 7
    Evaluation of the fracture behaviour of surface mounted technology components by electrical measurements

    Evaluation of the fracture behaviour of surface mounted technology components by electrical measurements by Kyrychenko, Mykhailo, Wohlrabe, Heinz, Meyer, Sebastian, Reuter, Hartmut, Keil, Mathias

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  8. 8
    Statistical modeling and simulation of SMD-mounting process

    Statistical modeling and simulation of SMD-mounting process by Wohlrabe, H.

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  9. 9
    Factors influencing the formation of voids in chip component solder joints

    Factors influencing the formation of voids in chip component solder joints by Pantazica, Mihaela, Svasta, Paul, Wohlrabe, Heinz, Wolter, Klaus-Jurgen

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  10. 10
    Changes of the coplanarity of SMT-components during soldering and their Measurement

    Changes of the coplanarity of SMT-components during soldering and their Measurement by Wohlrabe, Heinz, Wolter, Klaus-Jürgen

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  11. 11
    Data mining in electronics packaging

    Data mining in electronics packaging by Meyer, S., Wohlrabe, H., Wolter, K.-J.

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  12. 12
    Evaluation of the effects of the layout design on the quality of surface mount boards

    Evaluation of the effects of the layout design on the quality of surface mount boards by Pantazica, Mihaela, Marghescu, Cristina, Tamas, Cosmin, Wohlrabe, Heinz, Wolter, Klaus-Jurgen, Svasta, Paul

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  13. 13
    Process and material effects on BGA board level solder joint reliability

    Process and material effects on BGA board level solder joint reliability by Meyer, S., Metasch, R., Schwerz, R., Wohlrabe, H., Wolter, K.-J

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  14. 14
    Neural network modeling to predict quality and reliability for BGA solder joints

    Neural network modeling to predict quality and reliability for BGA solder joints by Meyer, Sebastian, Wohlrabe, Heinz, Wolter, Klaus-Jurgen

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  15. 15
    Optimization of SMT solder joint quality by variation of material and reflow parameters

    Optimization of SMT solder joint quality by variation of material and reflow parameters by Wohlrabe, H., Herzog, T., Wolter, K.-J.

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  16. 16
    Practical Usage of Design of Experiments in SMT-Production Processes

    Practical Usage of Design of Experiments in SMT-Production Processes by Wohlrabe, H., Wolter, K.-J.

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  17. 17
    Practical Usage of Design of Experiments in the Production of SMT-Boards

    Practical Usage of Design of Experiments in the Production of SMT-Boards by Wohlrabe, H., Wolter, K.J.

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  18. 18
    Reliability Qualification of Flexible Printed Circuits with Common and New Methods

    Reliability Qualification of Flexible Printed Circuits with Common and New Methods by Detert, Markus, Ernst, Daniel, Zerna, Thomas, Wohlrabe, Heinz, Wolter, Klaus-jurgen

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  19. 19
    Process and machine capabilities of soldering processes

    Process and machine capabilities of soldering processes by Heinz, W.

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