Search Results - Wong, C.K.Y.

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  1. 1
    Two-phase cooling of light emitting diode for higher light output and increased efficiency

    Two-phase cooling of light emitting diode for higher light output and increased efficiency by Ye, H., Mihailovic, M., Wong, C.K.Y., van Zeijl, H.W., Gielen, A.W.J., Zhang, G.Q., Sarro, P.M.

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  2. 2
    Interfacial Adhesion Study for SAM Induced Covalent Bonded Copper-EMC Interface by Molecular Dynamics Simulation

    Interfacial Adhesion Study for SAM Induced Covalent Bonded Copper-EMC Interface by Molecular Dynamics Simulation by Wong, C.K.Y., Haibo Fan, Yuen, M.M.F.

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  3. 3
    A New Approach in Measuring Cu-EMC Adhesion Strength by AFM

    A New Approach in Measuring Cu-EMC Adhesion Strength by AFM by Wong, C.K.Y., Hongwei Gu, Bing Xu, Yuen, M.M.F.

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  4. 4
    Evaluation and selection of sensing materials for carbon dioxide (CO2) sensor by molecular modeling

    Evaluation and selection of sensing materials for carbon dioxide (CO2) sensor by molecular modeling by Chen, X.P., Wong, C.K.Y., Yuan, C.A., Zhang, G.Q.

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  5. 5
    Hydrophobic self assembly molecular layer for reliable Cu-epoxy interface

    Hydrophobic self assembly molecular layer for reliable Cu-epoxy interface by Wong, C.K.Y., Yuen, M.M.F.

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  6. 6
    Thiol based chemical treatment as adhesion promoter for Cu-epoxy interface

    Thiol based chemical treatment as adhesion promoter for Cu-epoxy interface by Wong, C.K.Y., Yuen, M.M.F.

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  7. 7
    A multi-scale interfacial delamination model of Cu-SAM-epoxy systems

    A multi-scale interfacial delamination model of Cu-SAM-epoxy systems by Fan, H.B., Wong, C.K.Y., Yuen, M.M.F.

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  8. 8
    Hydrophobic self-assembly monolayer structure for reduction of interfacial moisture diffusion

    Hydrophobic self-assembly monolayer structure for reduction of interfacial moisture diffusion by Fan, H.B., Wong, C.K.Y., Yuen, M.M.F.

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  9. 9
    Prediction of Material Properties of Epoxy Materials using Molecular Dynamic Simulation

    Prediction of Material Properties of Epoxy Materials using Molecular Dynamic Simulation by Fan, H.B., Wong, C.K.Y., Yuen, M.M.F.

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  10. 10
    Kinetics Study of Disulfide Self Assembly Monolayer (SAM) Deposition for Cu-EMC Adhesion Promotion

    Kinetics Study of Disulfide Self Assembly Monolayer (SAM) Deposition for Cu-EMC Adhesion Promotion by Wong, C.K.Y., Min Zheng, Bing Xu, Yuen, M.M.F.

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  11. 11
    Study on Thermal Interface Material with Carbon Nanotubes and Carbon Black in High-Brightness LED Packaging with Flip-Chip

    Study on Thermal Interface Material with Carbon Nanotubes and Carbon Black in High-Brightness LED Packaging with Flip-Chip by Kai Zhang, Guo-Wei Xiao, Wong, C.K.Y., Hong-Wei Gu, Yuen, M.M.F., Chan, P.C.H., Bing Xu

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  12. 12
    Moisture diffusion study in electronic packaging using molecular dynamic simulation

    Moisture diffusion study in electronic packaging using molecular dynamic simulation by Fan, H.B., Chan, E.K.L., Wong, C.K.Y., Yuen, M.M.F.

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  13. 13
    Kinetic Study of Disulfide Molecular Film Deposition for Cu-EMC Adhesion Promotion

    Kinetic Study of Disulfide Molecular Film Deposition for Cu-EMC Adhesion Promotion by Wong, C.K.Y., Min Zheng, Bing Xu, Yuen, M.M.F.

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  14. 14
    A new method to predict delamination in electronic packages

    A new method to predict delamination in electronic packages by Fan, H.B., Wong, C.K.Y., Yuen, M.M.F.

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  15. 15
    Interfacial strength assessment of Cu-epoxy system by atomic force microscope

    Interfacial strength assessment of Cu-epoxy system by atomic force microscope by Wong, C.K.Y., Kuznetsov, E.V., Bing Xu, Yuen, M.M.F.

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  16. 16
    Investigation of adhesion properties of Cu-EMC interface by molecular dynamic simulation

    Investigation of adhesion properties of Cu-EMC interface by molecular dynamic simulation by Wong, C.K.Y., Haibo Fan, Yuen, M.M.F.

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  17. 17
    Reliability prediction in electronic packages using molecular simulation

    Reliability prediction in electronic packages using molecular simulation by Fan, H.B., Wong, C.K.Y., Yuen, M.M.F.

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  18. 18
    A new approach in measuring Cu-EMC adhesion strength by AFM

    A new approach in measuring Cu-EMC adhesion strength by AFM by WONG, Cell K. Y, HONGWEI GU, BING XU, YUEN, Matthew M. F

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  19. 19
    The effect of globtop process and material condition on voiding

    The effect of globtop process and material condition on voiding by Wong, C.K.Y., Teng, A.

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  20. 20
    Thermal cycling simulation in electronic packages using molecular dynamic method

    Thermal cycling simulation in electronic packages using molecular dynamic method by Fan, H.B., Edward, Chan, K.L., Wong, C.K.Y., Yuen, M.M.F.

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