Search Results - Wontor, D.

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  1. 1
    A study of electromigration failure in Pb-free solder joints

    A study of electromigration failure in Pb-free solder joints by Min Ding, Guotao Wang, Chao, B., Ho, P.S., Peng Su, Uehling, T., Wontor, D.

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  2. 2
    An evaluation of electromigration performance of SnPb and Pb-free flip chip solder joints

    An evaluation of electromigration performance of SnPb and Pb-free flip chip solder joints by Peng Su, Min Ding, Uehling, T., Wontor, D., Ho, P.S.

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    Performance of evaporated and plated bumps on organic substrates

    Performance of evaporated and plated bumps on organic substrates by Mistry, A., Czarnowski, J., Beddingfield, C., Tan, Q., Guajardo, J., Rhyner, K., Kleffner, J., Scanlon, T., Lozano, J., Wontor, D., Scott, K.

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    C4 makes way for electroplated bumps

    C4 makes way for electroplated bumps by CLEGG, DAVID, COLE, REBECCA, FRANKA, JOHN, MITCHELL, DOUG, WONTOR, DAVE

    Published in Solid state technology
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