EUVL: Challenges to Manufacturing Insertion by Wood, Obert R., II

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Extreme Ultraviolet Lithography Development in the United States by Wood, Obert

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Extreme ultraviolet lithography: From research to manufacturing by La Fontaine, Bruno, Deng, Yunfei, Kim, Ryoung-han, Levinson, Harry J., Okoroanyanwu, Uzodinma, Sandberg, Richard, Wallow, Tom, Wood, Obert

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Thin absorber extreme ultraviolet photomask based on Ni-TaN nanocomposite material by Hay, Darrick, Bagge, Patrick, Khaw, Ian, Sun, Lei, Wood, Obert, Chen, Yulu, Kim, Ryoung-Han, Qi, Zhengqing John, Shi, Zhimin

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Phase measurements of EUV mask defects by Claus, Rene A., Wang, Yow-Gwo, Wojdyla, Antoine, Benk, Markus P., Goldberg, Kenneth A., Neureuther, Andrew R., Naulleau, Patrick P., Waller, Laura

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EUV Lithography: New Metrology Challenges by Wood, Obert

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Experimental measurements of telecentricity errors in high-numerical-aperture extreme ultraviolet mask images by Raghunathan, Sudharshanan, Wood, Obert R., Mangat, Pawitter, Verduijn, Erik, Philipsen, Vicky, Hendrickx, Eric, Jonckheere, Rik, Goldberg, Kenneth A., Benk, Markus P., Kearney, Patrick, Levinson, Zachary, Smith, Bruce W.

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Fourier spectrum method to determine dose-to-clear in a photoresist by Sun, Lei, Wood, Obert, Clifford, Chris, Raghunathan, Sudhar, Kritsun, Oleg, Lee, Myungjun, Kim, Ryoung-Han, Mangat, Pawitter, Koh, Hui Peng, Levinson, Harry

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Synchrotron radiation sources and condensers for projection x-ray lithography by Murphy, J B, White, D L, Macdowell, A A, Wood Ii, O R

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Pathway to sub-30nm Resolution in EUV Lithography by Thakerlay, James W., Nassar, Roger A., Spear-Alfonso, Kathleen, Brainard, Robert, Goldfarb, Dario, Wallow, Thomas, Wei, Yayi, Montgomery, Warren, Petrillo, Karen, Wood, Robert, Koay, Chief-seng, Mackey, Jeff, Naulleau, Patrick, Pierson, Bill, Solak, Harun H.

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Actinic inspection of extreme ultraviolet programed multilayer defects and cross-comparison measurements by Goldberg, Kenneth A., Barty, Anton, Liu, Yanwei, Kearney, Patrick, Tezuka, Yoshihiro, Terasawa, Tsuneo, Taylor, John S., Han, Hak-Seung, Wood, Obert R.

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EUV lithography development in the United States by Wood, O.

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Experimental determination of image placement accuracy in extreme ultraviolet lithography by Raghunathan, Sudhar, Wood, Obert, Vukkadala, Pradeep, Engelstad, Roxann, Hartley, John G.

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Submicron, soft x-ray fluorescence imaging by La Fontaine, Bruno, MacDowell, Alastair A., Tan, Zhengquan, White, Don L., Taylor, Gary N., Wood, Obert R., Bjorkholm, John E., Tennant, Don M., Hulbert, Steven L.

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Vacuum ultraviolet loss in magnesium fluoride films by Wood, O R, Craighead, H G, Sweeney, J E, Maloney, P J

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Are extreme ultraviolet resists ready for the 32 nm node? by Petrillo, Karen, Wei, Yayi, Brainard, R., Denbeaux, G., Goldfarb, Dario, Koay, C.-S., Mackey, J., Montgomery, Warren, Pierson, W., Wallow, T., Wood, Obert

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Are extreme ultraviolet resists ready for the 32nm node? by Petrillo, Karen, Wei, Yayi, Brainard, R., Denbeaux, G., Goldfarb, Dario, Koay, C.-S., Mackey, J., Montgomery, Warren, Pierson, W., Wallow, T., Wood, Obert

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High-pressure pulsed molecular lasers by Wood, O.R.

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High-gain inner-shell photoionization laser in Cd vapor pumped by soft-X-ray radiation from a laser-produced plasma source by SILFVAST, W. T, MACKLIN, J. J, WOOD, O. R. II

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New recombination lasers in Li, Al, Ca and Cu in a segmented plasma device employing foil electrodes by Macklin, J., Wood, O., Silfvast, W.

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