Search Results - Xiong, Bifu

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  1. 1
    Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere

    Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere by He, Siliang, Shen, Yu-An, Xiong, Bifu, Huo, Fupeng, Li, Jiahui, Ge, Jinguo, Pan, Zhiliang, Li, Wangyun, Hu, Chuan, Nishikawa, Hiroshi

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  2. 2
    Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid-Liquid System under Formic Acid Atmosphere

    Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid-Liquid System under Formic Acid Atmosphere by He, Siliang, Xiong, Bifu, Xu, Fangyi, Chen, Biyang, Cui, Yinhua, Hu, Chuan, Yue, Gao, Shen, Yu-An

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  3. 3
    Cu-Cu joint with Sn-58Bi/Porous Cu/Sn-58Bi transient liquid phase bonding under formic acid atmosphere

    Cu-Cu joint with Sn-58Bi/Porous Cu/Sn-58Bi transient liquid phase bonding under formic acid atmosphere by Xiong, Bifu, He, Siliang, Ge, Jinguo, Li, Quantong, Hu, Chuan, Yan, Haidong, Shen, Yu-An

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