Current Status of Research and Development for Three-Dimensional Chip Stack Technology by Kenji Takahashi, Kenji Takahashi, Hiroshi Terao, Hiroshi Terao, Yoshihiro Tomita, Yoshihiro Tomita, Yasuhiro Yamaji, Yasuhiro Yamaji, Masataka Hoshino, Masataka Hoshino, Tomotoshi Sato, Tomotoshi Sato, Tadahiro Morifuji, Tadahiro Morifuji, Masahiro Sunohara, Masahiro Sunohara, Manabu Bonkohara, Manabu Bonkohara

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Anisotropic Deposition of Localized Electroless Nickel for Preferential Bridge Connection by Yokoshima, Tokihiko, Yamaji, Yasuhiro, Kikuchi, Katsuya, Nakagawa, Hiroshi, Aoyagi, Masahiro

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Maskless Fabrication for Micropad Interconnection using Electroless NiB Deposition and Application to "Chemical" Flip-Chip Bonding by Yokoshima, Tokihiko, Yamaji, Yasuhiro, Igawa, Noboru, Kikuchi, Katsuya, Nakagawa, Hiroshi, Aoyagi, Masahiro

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Interconnection of Multi-Pad Electrodes by "Controlled Anisotropic Extraneous (CAEx) Deposition" of Electroless NiB Film by Yokoshima, Tokihiko, Yamaji, Yasuhiro, Igawa, Noboru, Tamura, Yuichiro, Kikuchi, Katsuya, Nakagawa, Hiroshi, Aoyagi, Masahiro

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Characteristics of Nonylphenol Polyethoxylate-Degrading Bacteria Isolated from Coastal Sediments by Maeda, Toshimichi, Hayakawa, Kazuhide, You, Mu, Sasaki, Makoto, Yamaji, Yasuhiro, Furushita, Manabu, Shiba, Tsuneo

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Formation of Au Microbump Arrays for Flip-Chip Bonding Using Electroless Au Deposition from a Non-Cyanide Plating Bath by Yokoshima, Tokihiko, Nomura, Kentaro, Yamaji, Yasuhiro, Kikuchi, Katsuya, Nakagawa, Hiroshi, Koshiji, Kohji, Aoyagi, Masahiro, Iwai, Ryota, Tokuhisa, Tomoaki, Kato, Masaru

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Growth and luminescence properties of Eu-doped HfO2/a-Al2O3 eutectic scintillator by Kei Kamada Kosuke Hishinuma Shunsuke Kurosawa Akihiro Yamaji Yasuhiro Shoji Jan Pejcha Yuji Ohashi Yuui Yokota Akira Yoshikawa

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A method of "chemical flip-chip bonding" without loading and heating for ultra-fine chip-to-substrate interconnects by Yokoshima, T., Yamaji, Y., Kikuchi, K., Nakagawa, H., Aoyagi, M.

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A Method of Fabricating Bump-Less Interconnects Applicable to Wafer-Scale Flip-Chip Bonding by Yamaji, Y., Yokoshima, T., Igawa, N., Kikuchi, K., Nakagawa, H., Aoyagi, M.

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Interconnection of Micropad Electrodes by Controlled “Extraneous” Deposition of Electroless NiB Film by Yokoshima, Tokihiko, Yamaji, Yasuhiro, Oosato, Hirotaka, Tamura, Yuichiro, Kikuchi, Katsuya, Nakagawa, Hiroshi, Aoyagi, Masahiro

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Novel Flip-Chip Bonding Technology using Chemical Process by Yamaji, Y., Yokoshima, T., Oosato, H., Igawa, N., Tamura, Y., Kikuchi, K., Nakagawa, H., Aoyagi, M.

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IMC study on Cu wirebond failures under high humidity conditions by Yamaji, Y., Hori, M., Ikenosako, H., Oshima, Y., Suda, T., Umeki, A., Kandori, M., Oida, M., Goto, H., Katsumata, A., Hiruta, Y.

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A novel Wafer level Fan-out Package (WFOP™) applicable to 50um pad pitch interconnects by Hayashi, N., Takahashi, T., Shintani, N., Kondo, T., Marutani, H., Takehara, Y., Higaki, K., Yamagata, O., Yamaji, Y., Katsumata, A., Hiruta, Y.

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Process integration of 3D chip stack with vertical interconnection by TAKAHASHI, Kenji, TAGUCHI, Yuichi, UMEMOTO, Mitsuo, KAMEYAMA, Kojiro, SUZUKI, Akira, OKAYAMA, Yoshio, YONEZAWA, Toshihiro, KONDO, Kazuo, TOMISAKA, Manabu, YONEMURA, Hitoshi, HOSHINO, Masataka, UENO, Mitsuo, EGAWA, Yoshimi, NEMOTO, Yoshihiko, YAMAJI, Yasuhiro, TERAO, Hiroshi

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Mechanical effects of copper through-vias in a 3D die-stacked module by Tanaka, N., Sato, T., Yamaji, Y., Morifuji, T., Umemoto, M., Takahashi, K.

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Compliant bump technology for back-side illuminated CMOS image sensor by Asano, T., Watanabe, N., Tsunoda, I., Kimiya, Y., Fukunaga, K., Handa, M., Arao, H., Yamaji, Y., Aoyagi, M., Higashimachi, T., Tanaka, K., Takao, T., Matsumura, K., Ikeda, A., Kuroki, Y., Tsurushima, T.

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Guidelines for structural and material-system design of a highly reliable 3D die-stacked module with copper through-vias by Tanaka, N., Yamaji, Y., Sato, T., Takahashi, K.

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New electrical modeling approach for simultaneous switching noise for high-performance packages by Kato, K., Miura, M., Ito, K., Yamaji, Y., Sudo, T.

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PRDM14 Ensures Naive Pluripotency through Dual Regulation of Signaling and Epigenetic Pathways in Mouse Embryonic Stem Cells by Yamaji, Masashi, Ueda, Jun, Hayashi, Katsuhiko, Ohta, Hiroshi, Yabuta, Yukihiro, Kurimoto, Kazuki, Nakato, Ryuichiro, Yamada, Yasuhiro, Shirahige, Katsuhiko, Saitou, Mitinori

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Binding Evaluation of Pradimicins for Oligomannose Motifs from Fungal Mannans by Nakagawa, Yu, Yamaji, Fumiya, Miyanishi, Wataru, Ojika, Makoto, Igarashi, Yasuhiro, Ito, Yukishige

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