Search Results - Yang, KiYeul

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  1. 1
    Semitransparent, thin metal grid-based hybrid electrodes for polymer solar cells

    Semitransparent, thin metal grid-based hybrid electrodes for polymer solar cells by Yang, Kiyeul, Rahman, Mohammad Arifur, Jeong, Kyunghoon, Nam, Ho-Seok, Kim, Jiyoung, Lee, Jaegab

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  2. 2
    ITO-free low-cost organic solar cells with highly conductive poly(3,4 ethylenedioxythiophene): p-toluene sulfonate anodes

    ITO-free low-cost organic solar cells with highly conductive poly(3,4 ethylenedioxythiophene): p-toluene sulfonate anodes by Rahman, Mohammad Arifur, Rahim, Abdur, Maniruzzaman, Md, Yang, Kiyeul, Lee, Chiyoung, Nam, Hoseok, Soh, Hoesup, Lee, Jaegab

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  3. 3
    ITO-free organic solar cell with an PEDOT:PTS/Au/TiO2 grid hybrid electrode as a transparent anode

    ITO-free organic solar cell with an PEDOT:PTS/Au/TiO2 grid hybrid electrode as a transparent anode by Yang, Kiyeul, Maniruzzaman, Md, Rahman, Mohammad Arifur, Abdur, Rahim, Jeong, Kyunghoon, Nam, Ho-Seok, Kim, Moon J., Lee, Jaegab

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  4. 4
    Optimization of Temporary Carrier Technology for HDFO Packaging

    Optimization of Temporary Carrier Technology for HDFO Packaging by Yoo, JinKun, Lee, DooWon, Yang, KiYeul, Kim, Ji Hyun, Do, WonChul, Khim, Jin Young

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  5. 5
    Heterogeneous Integration Using Organic Interposer Technology

    Heterogeneous Integration Using Organic Interposer Technology by Scott, George J., Bae, JaeHun, Yang, KiYeul, Ki, WonMyoung, Whitchurch, Nathan, Kelly, Mike, Zwenger, Curtis, Jeon, JongHyun, Hwang, TaeKyeong

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  6. 6
    A New RDL-First PoP Fan-Out Wafer-Level Package Process with Chip-to-Wafer Bonding Technology

    A New RDL-First PoP Fan-Out Wafer-Level Package Process with Chip-to-Wafer Bonding Technology by Son, SeungNam, Khim, DongHyun, Yun, SeokHun, Park, JunHwan, Jeong, EunTaek, Yi, JiHun, Yoo, JinKun, Yang, KiYeul, Yi, MinJae, Lee, SangHyoun, Do, WonChul, Khim, JinYoung

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