Dislocation analysis in STI structure of flash memory by advanced 3D TEM sample preparation approach by Chun-Hung Lin, Hsin-Cheng Hsu, Wei-Ming Hsiao, Chiu-Ru Guey, Chun-Ru Chan, Huai-San Ku, Dun-Fan Zhuang, Bang-Ying Chen, Ru-Hui Lin, Pe-Lin Hsu, Ko-Chun Lee, Chung, Sophia, Chin-Chih Yeh, Lian, N-T, Ta-Hone Yang, Chen, K-C

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Advanced CMP Process Control by Using Machine Learning Image Analysis by Hsu, Min-Hsuan, Lin, Chih-Chen, Yu, Hsiang-Meng, Chen, Kuang-Wei, Luoh, Tuung, Yang, Ling-Wuu, Yang, Ta-Hone, Chen, Kuang-Chao

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TiCl4 Barrier Process Engineering in Semiconductor Manufacturing by Luoh, Tuung, Huang, Yu-Kai, Hung, Yung-Tai, Yang, Ling-Wuu, Yang, Ta-Hone, Chen, Kuang-Chao

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Investigations on elimination of plasma-induced Si substrate damage for 3D NAND fabrication: AEPM: Advanced equipment processes and materials by Lin, Chih-Yao, Lo, Chieh, Chen, Wei-Chen, Yang, Zusing, Chang, Sheng-Yuan, Lee, Hong-Ji, Lian, Nan-Tzu, Yang, Ta-Hone, Chen, Kuang-Chao, Lu, Chih-Yuan

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Systematic Hot Spots Finding By Pattern Search with Similarity by Luoh, Tuung, Lv, Rong, Chen, Chi-min, Liao, Hsiang-Chou, Yang, Ling-Wu, Yang, Ta-hone, Chen, Kuang-Chao, Lu, Chih-Yuan

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Tungsten plug corrosion on B2H6-based nucleation layer induced by WCMP process by Kuang-Wei Chen, Meng-Tsung Ko, Chun-Fu Chen, Yung-Tai Hung, Chin-Ta Su, Ta-Hone Yang, Kuang-Chao Chen, Chih-Yuan Lu

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Smart Review Sampling Methodology in Huge Inspection Results by Luoh, Tuung, Lv, Rong, Chen, Chi-min, Liao, Hsiang-Chou, Yang, Ling Wu, Yang, Ta-hone, Chen, Kuang Chao, Lu, Chih Yuan

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Carbon Plug Application in 3D NAND Fabrication by Chang, Yu-Chih, Chen, Liang-Yu, Chen, Kuang-Wei, Luoh, Tuung, Yang, Ling-Wuu, Yang, Ta-Hone, Chen, Kuang-Chao

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