Stress migration model for Cu interconnect reliability analysis by Walter Yao, H., Yiang, Kok-Yong, Justison, Patrick, Rayasam, Mahidhar, Aubel, Oliver, Poppe, Jens

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Impact of TSV process on 14nm FEOL and BEOL reliability by Kannan, Sukeshwar, Premachandran, C. S., Smith, Daniel, Ranjan, Rakesh, Cimino, Salvatore, Kong Boon Yeap, Wu, George, Linjun Cao, Prabhu, Manjunatha, Agarwal, Rahul, Yao, Walter, England, Luke, Justison, Patrick

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A Realistic Method for Time-Dependent Dielectric Breakdown Reliability Analysis for Advanced Technology Node by Kong Boon Yeap, Fen Chen, Yao, Huade Walter, Tian Shen, Sing Fui Yap, Justison, Patrick

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An investigation of dielectric thickness scaling on BEOL TDDB by Tian Shen, Wenyi Zhang, Yeap, Kong Boon, Jing Tan, Yao, Walter, Justison, Patrick

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Impact of electrode surface modulation on time-dependent dielectric breakdown by Kong Boon Yeap, Tian Shen, Zhang, Galor Wenyi, Sing Fui Yap, Holt, Brian, Gondal, Arfa, Seungman Choi, San Leong Liew, Yao, Walter, Justison, Patrick

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A randomized, double-blind, placebo-controlled trial assessing the efficacy and safety of tegaserod in patients from China with chronic constipation by Lin, San-Ren, Ke, Mei-Yun, Luo, Jin-Yan, Yuan, Yao-Zong, Wang, Ji-Yao, diTommaso, Shelley, Walter, Verena, Huang, Jiaqing

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New approach of 90nm low-k interconnect evaluation using a voltage ramp dielectric breakdown (VRDB) test by Aubel, O., Kiene M, Yao, W.

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Stress-induced-voiding risk factor and stress migration model for Cu interconnect reliability by Yao, H. W., Justison, P., Poppe, J.

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New perspectives of dielectric breakdown in low-k interconnects by Kok-Yong Yiang, Yao, H.W., Marathe, A., Aubel, O.

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A Study on Effect of Top and Bottom Metal Plates on Stress Induced Voiding of Nose Type Single Via Structure by Kuppar, Aniketha Udupa, Zeng, Xu, Ng, Chai Wah, Lim, YH James, Yao, H. Walter, Khor, EE jan, Chockalingam, Ramasamy, Tan, Juan Boon

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TDDB Kinetics and their Relationship with the E- and √E-models by Yiang, Kok-Yong, Yao, H. Walter, Marathe, Amit

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Pulsed laser annealing of GaAs implanted with Se and Si by Rys, Andrew, Compaan, Alvin D, Bhat, Ajit, Yao, H. Walter, Shieh, Yanan

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Arterial abnormalities of the shoulder in athletes by Nuber, Gordon W., McCarthy, Walter J., Yao, James S.T., Schafer, Michael F., Suker, Jacob R.

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Climate change decisive for Asia’s snow meltwater supply by Kraaijenbrink, Philip D. A., Stigter, Emmy E., Yao, Tandong, Immerzeel, Walter W.

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Arterial abnormalities of the hand in athletes by Nuber, Gordon W., McCarthy, Walter J., Yao, James S.T., Schafer, Michael F., Suker, Jacob R.

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Smoking, drinking, diet and physical activity—modifiable lifestyle risk factors and their associations with age to first chronic disease by Ng, Ryan, Sutradhar, Rinku, Yao, Zhan, Wodchis, Walter P, Rosella, Laura C

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Vertically Resolved Analysis of the Madden‐Julian Oscillation Highlights the Role of Convective Transport of Moist Static Energy by Yang, Da, Yao, Lin, Hannah, Walter

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Quantum Sampling for Finite Key Rates in High Dimensional Quantum Cryptography by Yao, Keegan, Krawec, Walter O., Zhu, Jiadong

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Intercalation-driven ferroelectric-to-ferroelastic conversion in a layered hybrid perovskite crystal by Wu, Zhenyue, Li, Shunning, Yousry, Yasmin Mohamed, Wong, Walter P. D., Wang, Xinyun, Ma, Teng, Chen, Zhefeng, Shao, Yan, Liew, Weng Heng, Yao, Kui, Pan, Feng, Loh, Kian Ping

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Lake storage variation on the endorheic Tibetan Plateau and its attribution to climate change since the new millennium by Yao, Fangfang, Wang, Jida, Yang, Kehan, Wang, Chao, Walter, Blake A, Crétaux, Jean-François

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