Search Results - Yaung, Jack

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  1. 1
    Adhesive Force Characterization for MEM Logic Relays With Sub-Micron Contacting Regions

    Adhesive Force Characterization for MEM Logic Relays With Sub-Micron Contacting Regions by Yaung, Jack, Hutin, Louis, Jaeseok Jeon, Tsu-Jae King Liu

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  2. 2
    Characterization of Contact Resistance Stability in MEM Relays With Tungsten Electrodes

    Characterization of Contact Resistance Stability in MEM Relays With Tungsten Electrodes by Yenhao Chen, Nathanael, R., Jaeseok Jeon, Yaung, J., Hutin, L., Tsu-Jae King Liu

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  3. 3
    Scaled Micro-Relay Structure with Low Strain Gradient for Reduced Operating Voltage

    Scaled Micro-Relay Structure with Low Strain Gradient for Reduced Operating Voltage by Chen, I-Ru, Hutin, Louis, Park, Chanro, Lee, Rinus, Nathanael, Rhesa, Yaung, Jack, Jeon, Jaeseok, King Liu, Tsu-Jae

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    Conference Proceeding
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