On-chip spiral inductors suspended over deep copper-lined cavities by Hongrui Jiang, Ye Wang, Yeh, J.-L.A., Tien, N.C.

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Integrated polysilicon and DRIE bulk silicon micromachining for an electrostatic torsional actuator by Yeh, J.-L.A., Hongrui Jiang, Tien, N.C.

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Electrostatic model for an asymmetric combdrive by Yeh, J.-L.A., Hui, C.-Y., Tien, N.C.

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Copper-encapsulated silicon micromachined structures by Yeh, J.-L.A., Hongrui Jiang, Neves, H.P., Tien, N.C.

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Fabrication of high-performance on-chip suspended spiral inductors by micromachining and electroless copper plating by Jiang, H., Wang, Y., Yeh, J.-L.A., Tien, N.C.

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Electromagnetically shielded high-Q CMOS-compatible copper inductors by Hongrui Jiang, Yeh, J.-L.A., Ye Wang, Norman Tien

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Calculation of electrostatic forces and torques in MEMS using path-independent integrals by Hui, C-Y, Yeh, J-L A, Tien, N C

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Characterizations of adhesion and motion behavior for electrothermal actuator by Yen-Jyh Lai, Chengkuo Lee, Chia-Yu Wu, Wen-Chih Chen, Chihchung Chen, Weileun Fang, Yeh, J.-L.A., Ruey-Shing Huang

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