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Laser assisted transfer of solder material from a solid-state solder layer for mask-less formation of micro solder depots on Cu-pillars and ENIG pad structures
by
Fettke, Matthias
,
Baba, Rojhat
,
Kubsch, Timo
,
Friedrich, Georg
,
Thalmann, Robert
,
Bejugam, Vinith
,
Yeoh, Kim Hoey
,
Teutsch, Thorsten
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Conference Proceedings
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Bonding
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Bump
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Configurations
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Contact
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Copper
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Cu-Piliar
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Cu-Pillar
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Electronic Components
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Engineering
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Engineering, Electrical & Electronic
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Finishes
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Inspection
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Intermetallic Compounds
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Ion Beams
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Laser
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Laser Beam Heating
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Lasers
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Mask-Less
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Metallurgy
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Morphology
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Ieee Electronic Library (Iel) Conference Proceedings
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