The thermal stability and degradation mechanism of Cu/Mo nanomultilayers by Yeom, Jeyun, Lorenzin, Giacomo, Ghisalberti, Lea, Cancellieri, Claudia, Janczak-Rusch, Jolanta

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Ag particles for sinter bonding: Flakes or spheres? by Yeom, Jeyun, Nagao, Shijo, Chen, Chuantong, Sugahara, Tohru, Zhang, Hao, Choe, Chanyang, Li, Cai-Fu, Suganuma, Katsuaki

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Effect of residual stress and microstructure on mechanical properties of sputter-grown Cu/W nanomultilayers by Lorenzin, Giacomo, Klimashin, Fedor F., Yeom, Jeyun, Hu, Yang, Michler, Johann, Janczak-Rusch, Jolanta, Turlo, Vladyslav, Cancellieri, Claudia

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Fast and low-temperature sintering of Ag paste due to nanoparticles formed in situ by Yeom, Jeyun, Zhang, Hao, Li, Cai-Fu, Suganuma, Katsuaki

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Effect of polyol synthesis on sintering of microsized Ag particles by Yeom, Jeyun, Zhang, Zheng, Li, Cai-Fu, Suganuma, Katsuaki

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Evaluation of residual stresses in Cu/Mo, Cu/Nb nanomultilayers with a strong fiber texture by Yeom, Jeyun, Lorenzin, Giacomo, Cancellieri, Claudia, Janczak-Rusch, Jolanta

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Diffraction and microstructure study of miscible interfaces in metallic multilayers by Cancellieri, Claudia, Lorenzin, Giacomo, Yeom, Jeyun, Ariosa, Daniel

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Necking growth and mechanical properties of sintered Ag particles with different shapes under air and N.sub.2 atmosphere by Chen, Chuantong, Yeom, Jeyun, Choe, Chanyang, Liu, Guiming, Gao, Yue, Zhang, Zheng, Zhang, Bowen

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Necking growth and mechanical properties of sintered Ag particles with different shapes under air and N2 atmosphere by Chen, Chuantong, Yeom, Jeyun, Choe, Chanyang, Liu, Guiming, Gao, Yue, Zhang, Zheng, Zhang, Bowen, Kim, Dongjin, Suganuma, Katsuaki

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Large-area die-attachment by silver stress migration bonding for power device applications by Noh, Seungjun, Zhang, Hao, Yeom, Jeyun, Chen, Chuantong, Li, Caifu, Suganuma, Katsuaki

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Effect of electroless Cu depositions for micro-via structure and thermal cycling reliability by Zhang, Zheng, Hsieh, Ming-Chun, Liu, Ran, Yeom, Jeyun, Suetake, Aiji, Yoshida, Hiroshi, Chen, Chuantong, Kang, Joonhaeng, Honma, Hidekazu, Kitahara, Yuhei, Matsunami, Takashi, Otsuka, Kuniaki, Suganuma, Katsuaki

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Uncovering the origin of interface stress enhancement and compressive-to-tensile stress transition in immiscible nanomultilayers by Hu, Yang, Lorenzin, Giacomo, Yeom, Jeyun, Liyanage, Manura, Curtin, William A, Jeurgens, Lars P H, Janczak-Rusch, Jolanta, Cancellieri, Claudia, Turlo, Vladyslav

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