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    The experimental study for the solder joint reliability of high I/O FCBGAs with thermal loaded bend test

    The experimental study for the solder joint reliability of high I/O FCBGAs with thermal loaded bend test by Yeongshu Chen, Chingshun Wang, Shiah, A.C.

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    The experimental study for the solder joint reliability of high I/O FCBGAs with thermal loaded bend test

    The experimental study for the solder joint reliability of high I/O FCBGAs with thermal loaded bend test by Chen, Yeongshu, Wang, Chingshun, Shiah, A C

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