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Properties of isolation liner and electrical characteristics of high aspect ratio TSV in 3D stacking technology
by
DeokYoung Jung
,
Kwang-Jin Moon
,
Byung-Lyul Park
,
Gilheyun Choi
,
Ho-Kyu Kang
,
Chilhee Chung
,
Deok Young Jung
,
Yonghan Rho
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Breakdown Voltage
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Capacitance
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Engineering
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Engineering, Electrical & Electronic
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Engineering, Manufacturing
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Isolation Liner
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Materials Science
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Materials Science, Multidisciplinary
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Performance Evaluation
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Science & Technology
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Silicon
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Stacking
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Step-Coverage
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Technology
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Thermal Stability
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Three Dimensional Displays
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Through-Silicon Vias
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Tsv
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