Search Results - Young-Kun Jee

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  1. 1
    Effect of Zn on the intermetallics formation and reliability of Sn-3.5Ag solder on a Cu pad

    Effect of Zn on the intermetallics formation and reliability of Sn-3.5Ag solder on a Cu pad by Jee, Y.K., Ko, Y.H., Yu, Jin

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  2. 2
    Effect of Al addition in Sn-Ag solder on the interfacial reactions with Cu and ENIG metallizations

    Effect of Al addition in Sn-Ag solder on the interfacial reactions with Cu and ENIG metallizations by Young-Kun Jee, Yang-hua Xia, Jin Yu, Hyun-Woo Kang, Taek-Young Lee

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  3. 3
    Effects of Zn addition on the drop reliability of Sn–3.5Ag–xZn/Ni(P) solder joints

    Effects of Zn addition on the drop reliability of Sn–3.5Ag–xZn/Ni(P) solder joints by Jee, Y.K., Yu, Jin, Ko, Y.H.

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  4. 4
    Non-conductive film with Zn-nanoparticles (Zn-NCF) for 40μm pitch Cu-pillar/Sn–Ag bump interconnection

    Non-conductive film with Zn-nanoparticles (Zn-NCF) for 40μm pitch Cu-pillar/Sn–Ag bump interconnection by Shin, Ji-Won, Kim, Il, Choi, Yong-Won, Kim, Young Soon, Kang, Un Byung, Jee, Young Kun, Paik, Kyung-Wook

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  5. 5
    Effect of NCFs with Zn-nanoparticles on the interfacial reactions of 40 um pitch Cu pillar/Sn-Ag bump for TSV interconnection

    Effect of NCFs with Zn-nanoparticles on the interfacial reactions of 40 um pitch Cu pillar/Sn-Ag bump for TSV interconnection by Ji-Won Shin, Yong-Won Choi, Young Soon Kim, Un Byung Kang, Young Kun Jee, Kyung-Wook Paik

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  6. 6
    Development of anhydride-based NCFs for Cu/Sn-Ag eutectic bonding and process optimization for fine pitch TSV chip stacking

    Development of anhydride-based NCFs for Cu/Sn-Ag eutectic bonding and process optimization for fine pitch TSV chip stacking by Ji-Won Shin, Yong-Won Choi, Young Soon Kim, Un Byung Kang, Young Kun Jee, Ji Hwan Hwang, Kyung-Wook Paik

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  7. 7
    Interfacial reactions and drop reliabilities of lead-free solder joints with electrolytic Cu metallizations

    Interfacial reactions and drop reliabilities of lead-free solder joints with electrolytic Cu metallizations by Young Kun Jee, Jong Yeon Kim, Jin Yu, Taek Yeong Lee

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  8. 8
    Mechanical Characterization of Benzene cyclobutene (BCB) Used in Cu/polymer Hybrid Bonding

    Mechanical Characterization of Benzene cyclobutene (BCB) Used in Cu/polymer Hybrid Bonding by Phansalkar, Sukrut Prashant, Yang, Yu-Hsiang, Kim, Changsu, Han, Bongtae, Jee, Young Kun, Lee, Choong Seon, Kang, Un Byung, Lee, Jong Ho, Cheon, Sang

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  9. 9
    Assignment of opsonic values to pneumococcal reference serum 007sp and a second pneumococcal OPA calibration serum panel (Ewha QC sera panel B) for 11 serotypes

    Assignment of opsonic values to pneumococcal reference serum 007sp and a second pneumococcal OPA calibration serum panel (Ewha QC sera panel B) for 11 serotypes by Burton, Robert L., Kim, Han Wool, Lee, Soyoung, Kim, Hun, Seok, Jee-hyun, Ku, Kun Young, Seo, Jihye, Kim, Sun Jin, Xie, Jinfu, McGuinness, Debra, Skinner, Julie M., Choi, Seuk Keun, Baik, Yeong Ok, Bae, Sejong, Nahm, Moon H., Kim, Kyung-Hyo

    Published in Vaccine
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