Search Results - Yun, Changhan H.

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  1. 1
    Clean and Conductive Wafer Bonding for MEMS

    Clean and Conductive Wafer Bonding for MEMS by Yun, Changhan H., Martin, Jack, Chen, L, Frey, T. J.

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  2. 2
    Cross-sectional dilation mode resonator with very high electromechanical coupling up to 10% using AlN

    Cross-sectional dilation mode resonator with very high electromechanical coupling up to 10% using AlN by Chengjie Zuo, Yun, C. H., Stephanou, P. J., Sang-June Park, Lo, C.-S T., Mikulka, R., Lan, J.-H J., Velez, M. F., Shenoy, R. V., Jonghae Kim, Nowak, M. M.

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