Search Results - YunHyeon Ka

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  1. 1
    Issues in fatigue life prediction model for underfilled flip chip bump

    Issues in fatigue life prediction model for underfilled flip chip bump by Islam, N., Syed, A., TaeKyeong Hwang, YunHyeon Ka, WonJoon Kang

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    TIM selection methodology for high power flip chip packages

    TIM selection methodology for high power flip chip packages by Islam, Nokibul, SeoWon Lee, JoonYeob Lee, YunHyeon Ka, JinYoung Khim, Galloway, Jesse

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    Mechanical, thermal and electrical analysis of a compliant interconnect

    Mechanical, thermal and electrical analysis of a compliant interconnect by Galloway, J., Syed, A., WonJoon Kang, Jin Young Khim, Cannis, J., YunHyeon Ka, Seungmo Kim, TaeSeong Kim, GiSong Lee, SangHyun Ryu

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