Influence of small amount of Al and Cu on the microstructure, microhardness and tensile properties of Sn–9Zn binary eutectic solder alloy by Das, S.K., Sharif, A., Chan, Y.C., Wong, N.B., Yung, W.K.C.

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Embedded components in printed circuit boards: a processing technology review by Jillek, W., Yung, W.K.C.

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Effect of nano Ni additions on the structure and properties of Sn–9Zn and Sn–Zn–3Bi solders in Au/Ni/Cu ball grid array packages by Gain, Asit Kumar, Chan, Y.C., Yung, Winco K.C.

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Copper thickness and thermal reliability of microvias produced by laser-assisted seeding (LAS) process in printed circuit board (PCB) manufacture by Leung, E.S.W., Yung, W.K.C.

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Effect of Ag micro-particles content on the mechanical strength of the interface formed between Sn–Zn binary solder and Au/Ni/Cu bond pads by Das, S.K., Sharif, A., Chan, Y.C., Wong, N.B., Yung, W.K.C.

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A study of microvias produced by laser-assisted seeding mechanism in blind via hole plating of printed circuit board by Leung, E.S.W., Yung, W.K.C., Lee, W.B.

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Copper thickness and thermal reliability of microvias produced by laserassisted seeding LAS process in printed circuit board PCB manufacture by Leung, E.S.W., Yung, W.K.C.

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The control of the thin-plate welds geometry and microstructure by Yung, Winco K.C., Lee, W.B., Ralph, B., Fenn, R.

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Effect of small Sn-Ag-Cu additions on structure and properties of Sn-Zn-Bi solder/BGA during as-soldered and as-aged conditions by Gain, A.K., Chan, Y.C., Sharif, A., Yung, W.K.C.

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