Search Results - Zee, Bemice

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  1. 1
    High-res 3D X-ray microscopy for non-destructive failure analysis of chip-to-chip micro-bump interconnects in stacked die packages

    High-res 3D X-ray microscopy for non-destructive failure analysis of chip-to-chip micro-bump interconnects in stacked die packages by Zulkifli, Syahirah Md, Zee, Bemice, Wen Qiu, Gu, Allen

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  2. 2
    Defect Z-depth Determination in Flip-chip using lock-in thermography

    Defect Z-depth Determination in Flip-chip using lock-in thermography by Wen Qiu, Zee, Bemice, Deslandes, Herve, Lai, Brian, Tien, David

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