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Search Results - Zhao, Atman Yong
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Reliability Baseline Management and Applications in Semiconductor Manufacturing
by
Chien, Wei-Ting Kary
,
Zhao, Yong Atman
,
Zhang, Mark
,
Li, Ming
Published in
International journal of reliability, quality, and safety engineering
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THE TEST-TO-TARGET METHODOLOGIES FOR THE RISK ASSESSMENT OF SEMICONDUCTOR RELIABILITY
by
KARY CHIEN, WEI-TING
,
ATMAN, ZHAO YONG
,
CHANG, VENSON
,
WU, JEFF
Published in
International journal of reliability, quality, and safety engineering
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Investigations and detections on a new BEOL dielectric failure mechanism at advanced technologies
by
Chien, Wei-Ting Kary
,
Zhao, Yong Atman
,
Zhang, Liwen
,
Wang, Zhijuan
Published in
Microelectronics and reliability
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Early detection and prediction of HKMG SRAM HTOL performance by WLR PBTI tests
by
Chien, Wei-Ting Kary
,
Zhao, Yong Atman
,
Zhu, Yueqin
,
Song, Yongliang
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Microelectronics and reliability
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Influence of I/O oxide process on the NBTI performance of 28nm HfO2-based HKMG p-MOSFETs
by
Chien, Wei-Ting Kary
,
Zhu, Yueqin
,
Song, Yongliang
,
Zhao, Yong Atman
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Microelectronics and reliability
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The Failure Mechanism Worst Stress Condition for Hot Carrier Injection of NMOS
by
Song, Zhuo
,
Chen, Zhaoxing
,
Yong, Atman Zhao
,
Song, Yongliang
,
Wu, Jeff
,
Chien, Karry
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Length Dependence Effect in 40nm Cu Low-k Dielectric Breakdown
by
Song, Zhuo
,
Han, Kun
,
Zhang, Liwen
,
Atman, Zhao Y.
,
Wang, York
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The reversed intrinsic curve and voltage dependence for ultra-low k dielectrics
by
Chien, Wei-Ting Kary
,
Zhao, Atman Yong
,
Liwen Zhang
,
Cheng, Flora
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A Study On The Dielectric Intrinsic Breakdown Specification
by
Han, Kun
,
Zhao, Yong A.
,
Guo, Qiang
,
Chien, Wei-Ting Kary
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Early failure model analysis and improvement of the upstream electromigration in 45nm Cu low-k interconnects
by
Wang, D.
,
Zhao, A. Y.
,
Yu, L.
,
Wu, J.
,
Chang, V.
,
Chien, Wei-Ting Kary
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The worst stress condition of hot carrier degradation on high voltage LDMOSFET
by
Huayang, Sarah Zhou
,
Yongliang Song
,
Zhuo Song
,
Yanju, Lisa Yu
,
Yong, Atman Zhao
,
Wu, Jeff
,
Chang, Venson
,
Chien, Kary
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The electromigration failure mechanism for TSV process
by
Yong, L. V.
,
Zhao, Atman
,
Chen, Canny
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