Heat-Depolymerizable Polypropylene Carbonate as a Temporary Bonding Adhesive for Fabrication of Flexible Silicon Sensor Chips by Xue, Xingjun, Yang, Shujie, Wang, Zheyao

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Changes in force associated with the amount of aligner activation and lingual bodily movement of the maxillary central incisor by Li, Xiaowei, Ren, Chaochao, Wang, Zheyao, Zhao, Pai, Wang, Hongmei, Bai, Yuxing

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Void-formation in uncured and partially-cured BCB bonding adhesive on patterned surfaces by Song, Zhen, Wu, Dong, Zhu, Huizhong, Liu, Litian, Wang, Zheyao

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A Front-Side Released Single Crystalline Silicon Piezoresistive Microcantilever Sensor by Zhou, Youzheng, Wang, Zheyao, Zhang, Qi, Ruan, Wenzhou, Liu, Litian

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A chemisorption-based microcantilever chemical sensor for the detection of trimethylamine by Yang, Rui, Huang, Xin, Wang, Zheyao, Zhou, Youzheng, Liu, Litian

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Thermal Stresses of TSVs With Silicon Post Conductors and Polymer Insulators by Ma, Qing, Wu, Ke, Wang, Zheyao

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Cu-Cu Bonded Microbump Interconnects With a 10-μm Pitch for 3-D-Stacked Chiplets by Wang, Zilin, Wang, Ziqing, Wang, Zheyao

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Low-Temperature and CMP-Free Direct Bonding of Porous Cu Bumps by Wang, Zilin, Zhao, Wenjie, Wang, Zheyao

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Non-covalent dispersed carbon nanotube–benzocyclobutene composites as a bonding interface material for three-dimensional integration by Xu, Xiangming, Wang, Zheyao

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Thermal and Electrical Properties of BCB-Liner Through-Silicon Vias by Huang, Cui, Pan, Liyang, Liu, Ran, Wang, Zheyao

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A Microcalorimeter Integrated With Carbon Nanotube Interface Layers for Fast Detection of Trace Energetic Chemicals by Ruan, Wenzhou, Wang, Zheyao, Li, Yuanchao, Liu, Litian

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High aspect ratio copper through-silicon-vias for 3D integration by Song, Chongshen, Wang, Zheyao, Chen, Qianwen, Cai, Jian, Liu, Litian

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Mechanical Reliability Testing of Air-Gap Through-Silicon Vias by Huang, Cui, Wu, Ke, Wang, Zheyao

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Bottom-up copper electroplating using transfer wafers for fabrication of high aspect-ratio through-silicon-vias by Song, Chongshen, Wang, Zheyao, Liu, Litian

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Low Temperature Cu-Cu Bonding Using an Intermediate Sacrificial Sn Layer by Wang, Zilin, Shi, Yunfan, Wang, Zheyao

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Localized Synthesis of Carbon Nanotube Films on Suspended Microstructures by Laser-Assisted Chemical Vapor Deposition by Li, Yuanchao, Ruan, Wenzhou, Wang, Zheyao

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Design, fabrication and characterization of a two-step released silicon dioxide piezoresistive microcantilever immunosensor by Zhou, Youzheng, Wang, Zheyao, Wang, Chaonan, Ruan, Wenzhou, Liu, Litian

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Thermal Reliability Tests of Air-Gap TSVs With Combined Air-SiO2 Liners by Huang, Cui, Wu, Dong, Wang, Zheyao

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Design and analysis of a PZT-based micromachined acoustic sensor with increased sensitivity by Wang, Zheyao, Wang, Chao, Liu, Litian

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Polymer Liner Formation in High Aspect Ratio Through-Silicon-Vias for 3-D Integration by Huang, Cui, Chen, Qianwen, Wang, Zheyao

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