Search Results - de Boer, Hedzer A.

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    Residual stresses in microelectronics induced by thermoset packaging materials during cure

    Residual stresses in microelectronics induced by thermoset packaging materials during cure by Meuwissen, Marcel H.H., de Boer, Hedzer A., Steijvers, Henk L.A.H., Schreurs, Piet J.G., Geers, Marc G.D.

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