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Low-thermal expansion electrostatic chuck materials and clamp mechanisms in vacuum and air
by
van Elp, J.
,
Giesen, P.T.M.
,
de Groof, A.M.M.
Published in
Microelectronic engineering
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Microelectronic Engineering
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Electrical Breakdown Mechanism
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Electrostatic Chucks
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Engineering
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Ultralow Expansion Materials
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