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Development of electrochemical copper deposition screening methodologies for next generation additive selection
by
Ryan, Kevin
,
Dunn, Kathleen
,
Eisden, Jobert van
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Microelectronic engineering
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Properties of PEG, PPG and Their Copolymers: Influence on Copper Filling of Damascene Interconnects
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Ryan, Kevin
,
Dunn, Kathleen
,
van Eisden, Jobert
,
Adolf, James
Published in
Journal of the Electrochemical Society
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In situ monitoring of formation of InAs quantum dots and overgrowth by GaAs or AlAs
by
Yakimov, Michael
,
Tokranov, Vadim
,
Agnello, Gabriel
,
van Eisden, Jobert
,
Oktyabrsky, Serge
Published in
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
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Journal Of The Electrochemical Society
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Journal Of Vacuum Science & Technology B: Microelectronics And Nanometer Structures
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Journal Of Vacuum Science & Technology B: Microelectronics And Nanometer Structures Processing, Measurement, And Phenomena
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32 Nm Node
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Additives
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Beaker Plating
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Connectors
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American Institute Of Physics:jisc Collections:transitional Journals Agreement 2021-23 (Reading List)
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