Multi chip modules

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Bibliographic Details
Main Authors: Bruce, R. H., Meuli, W. P., Ho, J.
Format: Conference Proceeding
Language:English
Subjects:
Commercialization
Costs
Electronics packaging
Hardware > Emerging technologies
Hardware > Hardware test
Hardware > Robustness > Hardware reliability
Hardware > Very large scale integration design
Integrated circuit interconnections
Integrated circuit packaging
Integrated circuit technology
Joining processes
Lithography
Permission
Printed circuits
Online Access:Request full text
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Description
Summary:
ISSN:0738-100X
DOI:10.1145/74382.74447